Abstract: An assembly is disclosed for supporting and transporting integrated circuits (ICs) or circuit die. The ICs are held to a planar surface of a support plate by a magnet. Support plates can optionally be perforated in order to view and inspect the circuits being processed and allows fluids and gases to pass therethrough. A separator plate is used when a plurality of support plates are stacked on top of each other to separate the support plates. The support plates can be placed in a container to transport the circuits during the manufacturing process. The container and separator plate can also be perforated.