Patents by Inventor Frederick R. Deak

Frederick R. Deak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5236366
    Abstract: A high density electrical connector (10) includes a pair of plastic housings (12, 14) spring loaded by springs (50) to be driven apart and including guide surfaces (24, 34) and guide holes (30) that guide pins (52) on a mating component (60) to assure a proper alignment between circuit traces of component and connector and camming surfaces (24, 68) operable upon engagement to drive the housings relatively together to compress a flexible film elastomeric circuit (80) having traces (82) engaging with circuits (76) on a board (74) of a component. The film circuit includes a further elastomeric circuit held normally compressed by the housings under force of the mother board fastening means to interconnect to a further circuit (90) on the mother board (88). A use of the connector (10) includes electrically and mechanically interconnecting a component such as a hard drive disk to a component such as a computer.
    Type: Grant
    Filed: May 26, 1992
    Date of Patent: August 17, 1993
    Assignee: AMP Incorporated
    Inventors: Frederick R. Deak, Robert M. Renn, Keith L. Volz
  • Patent number: 5211566
    Abstract: A docking assembly including a guide housing (2) and camming assembly (38, 54 and 40) for mechanically interfacing a modular component (46) with a circuit board to thereby complete and protect multiple electrical connections therebetween. An interfacing connector (80) is also disclosed for providing an electrical and mechanical interface between a circuit board and a disk drive (82). The interfacing connector (80) allows high-density multiple electrical interconnections to the circuit board by the use of canted coil springs (100) for direct electrical contact with individual traces and/or contact pads on the circuit board. The interfacing connector (80) may also include a docking assembly (130) with guide channels (136) for guiding insertion of a circuit board to thereby insure the integrity of the electrical interconnections therebetween.
    Type: Grant
    Filed: August 11, 1992
    Date of Patent: May 18, 1993
    Assignee: AMP Incorporated
    Inventors: Warren A. Bates, Frederick R. Deak, David C. Johnson, Robert M. Renn, Keith L. Volz
  • Patent number: 5199882
    Abstract: Component package (10) includes component (24) having conductive pads (26) attached to the lid (20) of a housing (30) containing wires (14) of a cable (12) positioned therewithin to be engaged by an elastomeric connector (42) having a resilient core (44) with a thin, dielectric film (46) carrying conductive traces (48) extending over a tab (50) with the housing and lid driving the pads against the connector to interconnect the pads to the traces to the wires upon closure. In one embodiment, the wires (14) are solder coated (16) with a solder reflow effecting a tab to wire connection and in another embodiment, precious metal coatings are employed to allow pressure connection between wire and traces. Alternatively, coatings of conductive inks or conductive adhesives may be used. The conductive traces may be placed on centers appropriate to the particular centers in the array of conductive pads and in the array of wires, such centers being selectively varied.
    Type: Grant
    Filed: March 19, 1992
    Date of Patent: April 6, 1993
    Assignee: AMP Incorporated
    Inventors: Warren A. Bates, Frederick R. Deak, David C. Johnson, Keith L. Volz
  • Patent number: 5161981
    Abstract: A high density connector (10) includes a plastic housing (12) with covers (30, 38) hinged to a frame (14) and foldable thereagainst to compress a plurality of circuits (60, 67) fitted between the covers to engage and compress elastomeric members (46, 54) and be interconnected thereby through fasteners (76-82), clamping the assembly of circuits and housing together. Embodiments include having frame and cover hinged at the sides by hinges (36, 44) or at the ends by hinges (108, 116) and including integrally molded cover frame and hinges versions include interconnecting two or more boards from the same or opposite directions relative to the connector housing.
    Type: Grant
    Filed: March 10, 1992
    Date of Patent: November 10, 1992
    Assignee: AMP Incorporated
    Inventors: Frederick R. Deak, Lesley W. H. McCormick, George R. Schmedding, Keith L. Volz, Douglas M. Walburn
  • Patent number: 5123849
    Abstract: An electrical connector (30) includes a body (34) of elastomeric material having cavities (38) containing a conductive gel (42) operable upon deformation of the body of said connector to interconnect conductive pads (14, 22) between components such as a printed circuit board (12) and a chip carrier (18). An alternative embodiment uses a connector body (34') comprised of a sheet (48) of a low thermal coefficient of expansion material with separate inserts (50) of a higher thermal coefficient of expansion fitted in sheet perforations (49).
    Type: Grant
    Filed: June 13, 1991
    Date of Patent: June 23, 1992
    Assignee: AMP Incorporated
    Inventors: Frederick R. Deak, John R. Rowlette, Sr.
  • Patent number: 5098309
    Abstract: A high density electrical connector (10) includes a flexible circuit (28) carrying circuit traces (32, 34) mounted on rod elements (38) driven by a cam means (60) to provide wipe and backwipe interconnections between board circuit traces (14, 18). A shape memory alloy (84) is employed to effect cam drive in one embodiment and an operating arm is utilized to effect cam drive in another embodiment.
    Type: Grant
    Filed: April 15, 1991
    Date of Patent: March 24, 1992
    Assignee: AMP Incorporated
    Inventors: Frederick R. Deak, David J. Goetzinger, Robert M. Renn
  • Patent number: 5092781
    Abstract: An electrical connector (39) provides high density interconnections through contact paths of printed circuit pads (12, 31) via flexible circuit (22) having contact pads (26, 28) driven by a canted coil spring (40) formed of a shape memory alloy selectively responsive to variations in temperature applied to the coil through a medium, heated or cooled and supplied via passage (62) in the connector.
    Type: Grant
    Filed: November 8, 1990
    Date of Patent: March 3, 1992
    Assignee: AMP Incorporated
    Inventors: Albert Casciotti, Frederick R. Deak, David B. Wrisley, Jr.
  • Patent number: 5061191
    Abstract: An interposing connector for interconnecting a pattern of conductive areas of opposing spaced apart surfaces. The connector includes a housing having one or more openings therethrough. A plurality of canted coil springs are positioned within the housing so that outer coil portions are exposed to engage the conductive areas of the opposing surfaces to thereby establish the electrical interconnection. The canted coil springs are secured to the housing by retaining means, such as a retainer strip extending through the springs and secured to the housing. The springs may also be secured by heat staking or laser welding a portion thereof to the housing. The canted coil springs have a relatively constant compliance over a range of radial deflection. The springs also produce contact wipe over the conductive areas and establish redundant contact points therewith.
    Type: Grant
    Filed: December 21, 1990
    Date of Patent: October 29, 1991
    Assignee: AMP Incorporated
    Inventors: Albert Casciotti, Frederick R. Deak, Ronald A. Dery, David B. Wrisley, Jr.
  • Patent number: 5037312
    Abstract: An electrical connector (30) includes a body (34) of elastomeric material having cavities (38) containing a conductive gel operable upon deformation of the body of said connector to interconnect conductive pads (16, 22) between components such as a printed circuit board (12) and a chip carrier (20).
    Type: Grant
    Filed: November 15, 1990
    Date of Patent: August 6, 1991
    Assignee: AMP Incorporated
    Inventors: Albert Casciotti, Frederick R. Deak, John R. Rowlette
  • Patent number: 5007842
    Abstract: An area array connector (10) employs a flexible interconnect member (30) having electrical circuitry including contact pads (32) which are forced into electrical contact with conductive pads (42) and (52) on a pair of stacked substrates (40) and (50) by means of a canted coil spring (24) that is held in a force application plate (20).
    Type: Grant
    Filed: October 11, 1990
    Date of Patent: April 16, 1991
    Assignee: AMP Incorporated
    Inventors: Frederick R. Deak, David B. Wrisley, Jr.
  • Patent number: 5006286
    Abstract: Polymeric electrically conductive apparatus such as electric connectors are disclosed. These connectors employ a polymeric conductive material such as a conductive epoxy having conductive particles dispersed therein sufficient to establish electrical conductivity. These conductive materials are at least initially deformable such that electrical conductors may be inserted within an envelope containing the conductive material and electrical continuity for a prescribed circuit can be verified before structurally affixing the conductors to the envelope. Embodiments having radially collapsible envelopes for forming splice connectors and multicontact configurations employing rigid dielectric housings are disclosed.
    Type: Grant
    Filed: March 31, 1986
    Date of Patent: April 9, 1991
    Assignee: AMP Incorporated
    Inventors: Ronald A. Dery, Frederick R. Deak, Richard H. Zimmerman