Abstract: Provided is a a method for manufacturing a metal smart card comprising a metal insert having a peripheral edge extending to the peripheral edge of the card and at least one printed cover sheet. The method comprises the steps of assembling a printed support sheet and at least one insert using an assembly tray comprising elements for positioning the support sheet and each insert, and extracting each metal smart card from the printed support sheet by cutting or machining the sheet around a periphery of the insert. Other embodiments disclosed.

Abstract: The invention relates to a method for manufacturing an antenna for a radiofrequency transponder, said antenna including a spiral comprising turns which extend, at least in part, over an insulating substrate; the method is characterised in that it includes the step ac-cording to which at least one first portion of each turn is deposited on said substrate at a first plane level, at least one second portion of each turn being formed or kept at a distance from the first plane level of the substrate, the axis of the spiral being parallel to the plane of the substrate. The invention also relates to a portable electronic object comprising, in a fixed or removable manner, the obtained antenna.

Abstract: Provided is a method for manufacturing a radiofrequency chip card. The method comprises the steps of: forming a card body comprising a relay antenna and an insulating cover layer on at least one main face of the card, arranging a module equipped with a radiofrequency module antenna on the card body opposite the relay antenna for radiofrequency coupling; forming a metal insert in the card body, the insert extending up to the edges of the card and comprising a space permeable to the radiofrequency field opening on at least one of the two main faces of the insert and comprising the relay antenna inside and/or opposite this space. Provided also is a corresponding card produced by the method.

Abstract: A method for producing a metal insert for a radio-frequency chip card includes the steps of forming or providing an assembly comprising an insulating substrate bearing: at least one antenna coil resting on the substrate, comprising a connection interface to a radio-frequency module, a metal plate comprising radio-frequency permittivity perforations and a cavity for receiving a radio-frequency chip module, respectively arranged facing the antenna coil and its connection interface. The perforations comprise at least two longitudinal slots extending along and facing a portion of the antenna coil, each slot also opening onto the edge of the plate via a passage arranged on the edge. The invention also relates to a corresponding card produced by the method.

Abstract: Radiofrequency device with adjustable LC circuit comprising an electrical and/or electronic module. The invention relates to a communication device with a radio-frequency chip, said device comprising—an insulating support layer, —an electrical and/or electronic radiofrequency circuit on said insulating layer, said circuit comprising plates of an adjustable capacitor and/or an antenna spiral with adjustable inductance, —at least one element for adjusting a tuning frequency of the radiofrequency circuit. The device is distinguished in that said plates and/or spiral are included in an electrical and/or electronic chip card module, and in that said adjusting element connects an intermediate point of the spiral so as to decrease the available inductance and/or splits or links the plates so as to adjust the capacitance.

Abstract: A method for producing a radiofrequency device having a first antenna circuit connected to a radiofrequency chip and a second antenna circuit associated with, or coupled to, the first circuit, the method including the following steps: formation of the first antenna circuit in the form of a conductive wire deposited in a guided manner on a first substrate; and formation of the second antenna circuit in the form of a conductive wire deposited on the same first substrate in a guided manner and at a calibrated distance from the first antenna circuit.

Abstract: A method for producing a metal insert for a radio-frequency chip card includes the steps of forming or providing an assembly comprising an insulating substrate bearing: at least one antenna coil resting on the substrate, comprising a connection interface to a radio-frequency module, a metal plate comprising radio-frequency permittivity perforations and a cavity for receiving a radio-frequency chip module, respectively arranged facing the antenna coil and its connection interface. The perforations comprise at least two longitudinal slots extending along and facing a portion of the antenna coil, each slot also opening onto the edge of the plate via a passage arranged on the edge. The invention also relates to a corresponding card produced by the method.

Abstract: Radiofrequency device with adjustable LC circuit comprising an electrical and/or electronic module. The invention relates to a communication device with a radio-frequency chip, said device comprising -an insulating support layer, -an electrical and/or electronic radiofrequency circuit on said insulating layer, said circuit comprising plates of an adjustable capacitor and/or an antenna spiral with adjustable inductance, -at least one element for adjusting a tuning frequency of the radiofrequency circuit. The device is distinguished in that said plates and/or spiral are included in an electrical and/or electronic chip card module, and in that said adjusting element connects an intermediate point of the spiral so as to decrease the available inductance and/or splits or links the plates so as to adjust the capacitance.

Abstract: The invention relates to a method for producing an intermediate device comprising an electronic module, said intermediate device being used to receive at least one film or portion of a film or covering layer, said device comprising: a supporting body; at least one area for the interconnection of an electric circuit, borne by the supporting body; and an electronic module connected to said interconnection area by an anisotropic connection material, said material being compressed between said area and the module. The method comprises the implementation of a means for maintaining the compressed state of said anisotropic material and/or a means for isolating said material from the outside of the supporting body.

Abstract: The invention relates to a method for manufacturing an antenna for a radiofrequency transponder, said antenna including a spiral comprising turns which extend, at least in part, over an insulating substrate; the method is characterised in that it includes the step ac-cording to which at least one first portion of each turn is deposited on said substrate at a first plane level, at least one second portion of each turn being formed or kept at a distance from the first plane level of the substrate, the axis of the spiral being parallel to the plane of the substrate. The invention also relates to a portable electronic object comprising, in a fixed or removable manner, the obtained antenna.

Abstract: The invention relates to a method for making an electronic module having an integrated circuit chip connected to an antenna. The method includes the steps of producing a module having electrical interconnection areas, a chip connected to the interconnection areas and a protection element covering at least the chip and part of the interconnection areas, and a radio antenna connected to the chip and arranged above the chip. The method includes a step of producing the entirety or part of the antenna, or the tracks thereof for coupling same with the interconnection areas, in three dimensions directly on the protection element.

Abstract: A method for producing a radiofrequency device having a first antenna circuit connected to a radiofrequency chip and a second antenna circuit associated with, or coupled to, the first circuit, the method including the following steps: formation of the first antenna circuit in the form of a conductive wire deposited in a guided manner on a first substrate; and formation of the second antenna circuit in the form of a conductive wire deposited on the same first substrate in a guided manner and at a calibrated distance from the first antenna circuit.

Abstract: A device according to claim 6, characterised in that the interrupting zone is positioned outside the switch zone in which two wires (54, 56) of a circuit are so arranged as to cooperate with the switch are positioned.

Abstract: Method of producing a device comprising at least two distinct components that are interconnected by interconnecting wires, and device thereby obtained. The invention relates to a method of producing a device having at least two distinct components which are interconnected on a substrate by at least one interconnecting wire. The method includes the following steps: creating the interconnecting wire by depositing individual wires on the substrate in a predefined interconnecting pattern, the wire comprising at least one terminal connection portion which is exposed on the substrate, bringing at least one contact of a component to face the terminal portion and connecting the contact to this terminal portion. The invention also relates to the device thereby obtained and to a multi-component product comprising same.

Abstract: The invention relates to a method for producing an intermediate device comprising an electronic module, said intermediate device being used to receive at least one film or portion of a film or covering layer, said device comprising: a supporting body; at least one area for the interconnection of an electric circuit, borne by the supporting body; and an electronic module connected to said interconnection area by an anisotropic connection material, said material being compressed between said area and the module. The method comprises the implementation of a means for maintaining the compressed state of said anisotropic material and/or a means for isolating said material from the outside of the supporting body.

Abstract: The invention relates to a portable electronic device comprising a supporting member receiving on one side conductive contact lands or tracks extending substantially as far as the edge of the side and connecting an electronic microcircuit, the conductive contact lands or tracks comprising a plurality of perforations. The device is noteworthy in that the interior of the perforations is free, or intended to be kept free, of metal.

Abstract: The invention relates to a radio frequency device including an antenna connected to a capacitor. Said capacitor includes first and second conductive plates that are opposite each other and separated by an insulator. At least one of said first and second plates is formed of a plurality of wire capacitor portions. Said radio frequency device is different in that the antenna and at least one capacitor plate are formed with wire portions placed on a substrate in a guided manner.

Abstract: The invention relates to a method for making an electronic module having an integrated circuit chip connected to an antenna. The method includes the steps of producing a module having electrical interconnection areas, a chip connected to the interconnection areas and a protection element covering at least the chip and part of the interconnection areas, and a radio antenna connected to the chip and arranged above the chip. The method includes a step of producing the entirety or part of the antenna, or the tracks thereof for coupling same with the interconnection areas, in three dimensions directly on the protection element.

Abstract: The invention relates to a radiofrequency device comprising a passive antenna tuned or intended to be tuned in frequency with at least one transponder, said transponder comprising an integrated circuit chip linked to an antenna interface defining an electromagnetic coupling surface periphery, said passive antenna comprising a main loop formed of turns comprising at least one portion of surface (B) inside the loop, at least one recess of the main loop, oriented from the interior to the exterior of the main loop, said portion of surface (B) being located in said recess so as to effect an electromagnetic coupling with a transponder circuit; the device is distinguished in that it comprises two recesses receiving or intended to receive a transponder each.

Abstract: A device having an integrated-circuit chip includes an insulating body containing at least one conductive pad, at least one electrical contact opposite the electrically conductive pad, and at least one recess in the body, including a bottom and one aperture. The recess is connected, at the bottom thereof, to the conductive pad and, at the aperture thereof, to the electrical contact. At least one coil spring is arranged in the recess and connecting the conductive pad to the electrical contact. The installation of the spring in the recess is facilitated by means of the friction of the central portion of the spring relative to the walls of the recess. The invention also relates to a method for producing an electrical connection between at least one conductive pad arranged in an insulating body and at least one electrical contact arranged opposite the electrically conductive pad.