Abstract: A low mass self-aligning wire clamp jaw assembly is provided which may be employed as a replaceable wire clamp jaw assembly or as a complete integrated wire clamp assembly with an actuator. The novel self-aligning wire clamp jaw assembly comprises a wire clamp jaw mounting arm which is adapted to be connected to a bonding head support. The wire clamp jaw mounting arm serves as a fixed lever to which is attached a first fixed flat surface clamping jaw and also serves as a mount to which a second and pivotal jaw is positioned juxtaposed the first jaw. A force mounting spring is also mounted on the mounting arm for applying a unidirectional force to one end of the second pivotal jaw to bias the pivotal jaw in a normally open or normally closed position.

Abstract: An improved automatic wire feed system for supplying a fine wire to a capillary bonding tool or to a wedge bonding tool is provided. The wire feed system includes a novel wire feed slack loop device which is mounted on the wire bonder between the bonding tool and the source of fine wire. The novel wire feed slack loop device comprises a pair of sector plates which are closely spaced apart from each other to provide an air space therebetween for receiving the fine wire. Compressed air is supplied to the air space between the sector plates and is directed radially outward by a diffuser shim plate which forces the wire to form into a uniform circular shape in the air space. Sensor means are provided at the outer perimeter of the sector plates which sense the position of the fine wire and supplies a signal to control means which turns off the rotation of the drive motor.

Abstract: A wire bonding machine for wedge bonding fine wires to semiconductor devices is provided with a rotating bonding head which is mounted on a fixed machine frame and having a X-Y table mounted on the fixed machine frame opposite a vertically movable bonding tool mounted on the rotating bonding head. The bonding head is provided with means for articulating the bonding tool in a vertical direction and in a rotational direction. The rotational movement of the novel bonding head does not impart vertical movement to the bonding tool.

Abstract: A wire bonding machine for wedge bonding fine wires to semiconductor devices is provided with a rotating bonding head which is mounted on a fixed machine frame and having a X-Y table mounted on the fixed machine frame opposite a vertically movable bonding tool mounted on the rotating bonding head. The bonding head is provided with means for articulating the bonding tool in a vertical direction and in a rotational direction. The rotational movement of the novel bonding head does not impart vertical movement to the bonding tool.

Abstract: An apparatus for automatically positioning a wire bonding machine at a second bond position is provided with a plurality of individually adjustable second bond positioning devices set at second bond positions and cooperable with second bond positioning actuating means. After positioning a semiconductor at a first bond position and completing a first bond, the second bond actuating means cooperating with a second bond positioning device automatically moves the semiconductor to a second bond position. After completing the second bond, the second bond positioning actuating means is released permitting the semiconductor to return to a first bond position as another second bond positioning device is cycled into active position.