Abstract: A film inspection apparatus is provided for detecting changes in surface profile of film, e.g., edge breaks sprocket hole tears, poor splices, etc. The film inspection apparatus includes a device mounted above a sapphire film support and having a pair of cantilever jewel carrying members for feeling the surface profile adjacent each edge of a traveling web of film. Each cantilever includes a thin vane which extends into and modulates a respective light beam which is incident upon a respective photocell. Each photocell is connected to a separate channel of a braking circuit to operate a brake for the film driving mechanism when a surface profile is encountered which is to be considered as an unacceptable flaw.