Patents by Inventor Frederick W. Warning

Frederick W. Warning has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11728618
    Abstract: An optoelectronic assembly and methods of fabrication thereof are provided. The assembly includes a sub-mount, one or more micro-devices attached to the sub-mount, and a lid attached to the sub-mount. The lid includes a dispense channel and a gel groove which allows for a thermal gel to be dispensed between the lid and the micro-device in a manner that mitigates the thermal gel dispersing and/or flowing onto components of the micro-devices.
    Type: Grant
    Filed: November 29, 2021
    Date of Patent: August 15, 2023
    Assignee: Cisco Technology, Inc.
    Inventor: Frederick W. Warning, Jr.
  • Patent number: 11258229
    Abstract: An optoelectronic assembly and methods of fabrication thereof are provided. The assembly includes a sub-mount, one or more micro-devices attached to the sub-mount, and a lid attached to the sub-mount. The lid includes a dispense channel and a gel groove which allows for a thermal gel to be dispensed between the lid and the micro-device in a manner that mitigates the thermal gel dispersing and/or flowing onto components of the micro-devices.
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: February 22, 2022
    Assignee: Cisco Technology, Inc.
    Inventor: Frederick W. Warning, Jr.
  • Patent number: 6206276
    Abstract: A method for providing fluxless soldering without oxide formation includes mounting a component on a pedestal of a base. A housing is also mounted on the base, the housing and the base together define a closed cavity containing the component. An inert gas is introduced into the cavity to create an inert gas-rich environment. Thereafter, the cavity is heated sufficiently to reflow solder provided between the component and the housing, to join the component to the housing without the formation of additional oxides on the solder joint.
    Type: Grant
    Filed: September 13, 1999
    Date of Patent: March 27, 2001
    Assignee: Lucent Technologies Inc.
    Inventors: Lu Fang, Brian Dale Potteiger, Frederick W. Warning, Frederick Arthur Yeagle