Abstract: An apparatus for drying one or more workpieces. The apparatus includes the use of a chemically reactive additive to remove contaminants from the wafer surface during processing. In particular, during processing, a wafer is rinsed in a liquid bath and subsequently exposed to a chemically reactive additive. The chemically reactive additive creates a surface tension gradient that physically and chemically alters the properties of the film of the rinse liquid so that the liquid and any contaminants contained therein are removed from the water surface.

Abstract: Disclosed is a method of removing liquid from a surface of a semiconductor wafer that comprises the steps of providing a plurality of capillary channels, each said capillary channel having a first opening and a second opening, and then placing said first openings in contact with the liquid in a manner effective in drawing away the liquid by capillary action.

Abstract: A method for drying one or more workpieces. The method includes the use of a chemically reactive additive to remove contaminants from the wafer surface during processing. In particular, during processing, a wafer is rinsed in a liquid bath and subsequently exposed to a chemically reactive additive. The chemically reactive additive creates a surface tension gradient that physically and chemically alters the properties of the film of the rise liquid so that the liquid and any contaminants contained therein are removed from the wafer surface.

Abstract: Semiconductor substrates are contacted with a deionized water solution containing an acidic material.

Abstract: The present invention is a method and apparatus for mechanically bonding a polymer to a convex surface of a substrate to provide intimate contact therebetween for improved energy transport between a transducer on one side of the substrate and a chemical bath on the other. The polymer seals the surface of the substrate from the chemical bath and may have a low adhesion to the substrate. A thin film of the polymer is brought under a tensile stress to provide intimate physical contact with most of the area of the convex surface. In one embodiment, the tensile stress is achieved by providing polymer as a liquid on the convex surface and then cooling to take advantage of differential thermal contraction between the polymer and the substrate to achieve the tensile stress in the polymer.

Abstract: Semiconductor substrates are contacted with a deionized water solution containing an acidic material.

Abstract: A method for reducing the corrosive chemical vapor permeability of a polyfluoroorgano resin substrate which comprises coating its outer surface with a vinylidene dichloride copolymer. The method produces a polyfluoroorgano resin substrate-vinylidene dichloride copolymer composite, for example a TEFLON-perfluoralkyl vinylether copolymer pipe having its surface immediate to the environment treated with a vinylidene dichloride/vinyl chloride copolymer.

Abstract: The present invention is a method and apparatus for mechanically bonding a polymer to a convex surface of a substrate to provide intimate contact therebetween for improved energy transport between a transducer on one side of the substrate and a chemical bath on the other. The polymer seals the surface of the substrate from the chemical bath and may have a low adhesion to the substrate. A thin film of the polymer is brought under a tensile stress to provide intimate physical contact with most of the area of the convex surface. In one embodiment, the tensile stress is achieved by providing polymer as a liquid on the convex surface and then cooling to take advantage of differential thermal contraction between the polymer and the substrate to achieve the tensile stress in the polymer.

Abstract: A method for reducing the chemical vapor permeability of a polyfluoroorgano resin substrate by coating its surface with a vinylidene dichloride copolymer is disclosed. The method produces a polyfluoroorgano resin substrate-vinylidene dichloride copolymer composite, for example a Teflon PFA pipe having its surface immediate to the environment treated with a vinylidene dichloride/vinyl chloride copolymer.

Abstract: The present invention is a method and apparatus for mechanically bonding a polymer to a convex surface of a substrate to provide intimate contact therebetween for improved energy transport between a transducer on one side of the substrate and a chemical bath on the other. The polymer seals the surface of the substrate from the chemical bath and may have a low adhesion to the substrate. A thin film of the polymer is brought under a tensile stress to provide intimate physical contact with most of the area of the convex surface. In one embodiment, the tensile stress is achieved by providing polymer as a liquid on the convex surface and then cooling to take advantage of differential thermal contraction between the polymer and the substrate to achieve the tensile stress in the polymer.