Abstract: An electro-optic display is produced using a sub-assembly comprising a front sheet, an electro-optic medium; and an adhesive layer. An aperture is formed through the adhesive layer where the adhesive layer is not covered by the electro-optic medium, and the sub-assembly is adhered to a backplane having a co-operating member with the aperture engaged with a co-operating member, thus locating the sub-assembly relative to the backplane. In another form of electro-optic display, a chip extends through an aperture in the electro-optic medium and adhesive layer. In a third form, the aforementioned sub-assembly is secured to a backplane and then a cut is made through both backplane and sub-assembly to provide an aligned edge.

Abstract: An electro-optic display is produced using a sub-assembly comprising a front sheet, an electro-optic medium; and an adhesive layer. An aperture is formed through the adhesive layer where the adhesive layer is not covered by the electro-optic medium, and the sub-assembly is adhered to a backplane having a co-operating member with the aperture engaged with a co-operating member, thus locating the sub-assembly relative to the backplane. In another form of electro-optic display, a chip extends through an aperture in the electro-optic medium and adhesive layer. In a third form, the aforementioned sub-assembly is secured to a backplane and then a cut is made through both backplane and sub-assembly to provide an aligned edge.

Abstract: An electro-optic display is produced using a sub-assembly comprising a front sheet, an electro-optic medium; and an adhesive layer. An aperture is formed through the adhesive layer where the adhesive layer is not covered by the electro-optic medium, and the sub-assembly is adhered to a backplane having a co-operating member with the aperture engaged with a co-operating member, thus locating the sub-assembly relative to the backplane. In another form of electro-optic display, a chip extends through an aperture in the electro-optic medium and adhesive layer. In a third form, the aforementioned sub-assembly is secured to a backplane and then a cut is made through both backplane and sub-assembly to provide an aligned edge.

Abstract: A display device includes a first electrode formed on a first substrate, and a second electrode formed on a second substrate. An electro-optical material is sandwiched between the first and second electrodes. A protective layer has a first section formed over the second substrate, a second section formed over the first substrate, and a third section formed between the first and second sections. The third section conforms to the shape of sides of the electro-optical material, the second electrode, and the second substrate.

Abstract: An electronic device (100) includes a first plane (102) and a second plane (103) where one of the planes can be deformed under mechanical pressure. A common contact region forms a cavity (145) on at least one of the first and second planes. An electrical connection (110) is configured to complete an electrical connection between the first and second planes wherein the electrical connection includes a solidified form of a liquid conductor dispensed in the cavity to complete an electrical path between the first and second planes.

Abstract: An electro-optic display is produced using a sub-assembly comprising a front sheet, an electro-optic medium; and an adhesive layer. An aperture is formed through the adhesive layer where the adhesive layer is not covered by the electro-optic medium, and the sub-assembly is adhered to a backplane having a co-operating member with the aperture engaged with a co-operating member, thus locating the sub-assembly relative to the backplane. In another form of electro-optic display, a chip extends through an aperture in the electro-optic medium and adhesive layer. In a third form, the aforementioned sub-assembly is secured to a backplane and then a cut is made through both backplane and sub-assembly to provide an aligned edge.

Abstract: An electro-optic display is produced using a sub-assembly comprising a front sheet, an electro-optic medium; and an adhesive layer. An aperture is formed through the adhesive layer where the adhesive layer is not covered by the electro-optic medium, and the sub-assembly is adhered to a backplane having a co-operating member with the aperture engaged with a co-operating member, thus locating the sub-assembly relative to the backplane. In another form of electro-optic display, a chip extends through an aperture in the electro-optic medium and adhesive layer. In a third form, the aforementioned sub-assembly is secured to a backplane and then a cut is made through both backplane and sub-assembly to provide an aligned edge.

Abstract: A method for fabricating an electronic device includes forming a layer of precursor material for forming a semi-conductor material in a cured state and exposing the precursor material to light. The precursor is heated in the presence of the light to form an insulator in areas exposed to light and a semiconductor in areas not exposed to the light. The light is preferably in the visible range. Suitable precursors may include 6,13-dihydro-6,13-(2,3,4,5-tetrachloro-2,4-cyclohexadieno)-pentacene (202) to form, for example, pentacene (204) as the semiconductor and 6,13-pentacenequinone (206) as an insulator. A device made in accordance with the method is also included.

Abstract: A display device includes a first electrode formed on a first substrate, and a second electrode formed on a second substrate. An electro-optical material is sandwiched between the first and second electrodes. A protective layer has a first section formed over the second substrate, a second section formed over the first substrate, and a third section formed between the first and second sections. The third section conforms to the shape of sides of the electro-optical material, the second electrode, and the second substrate.

Abstract: An electronic device (100) includes a first plane (102) and a second plane (103) where one of the planes can be deformed under mechanical pressure. A common contact region forms a cavity (145) on at least one of the first and second planes. An electrical connection (110) is configured to complete an electrical connection between the first and second planes wherein the electrical connection includes a solidified form of a liquid conductor dispensed in the cavity to complete an electrical path between the first and second planes.

Abstract: An electro-optic display is produced using a sub-assembly comprising a front sheet, an electro-optic medium; and an adhesive layer. An aperture is formed through the adhesive layer where the adhesive layer is not covered by the electro-optic medium, and the sub-assembly is adhered to a backplane having a co-operating member with the aperture engaged with a co-operating member, thus locating the sub-assembly relative to the backplane. In another form of electro-optic display, a chip extends through an aperture in the electro-optic medium and adhesive layer. In a third form, the aforementioned sub-assembly is secured to a backplane and then a cut is made through both backplane and sub-assembly to provide an aligned edge.

Abstract: A method for fabricating an electronic device includes forming a layer of precursor material for forming a semi-conductor material in a cured state and exposing the precursor material to light. The precursor is heated in the presence of the light to form an insulator in areas exposed to light and a semiconductor in areas not exposed to the light. The light is preferably in the visible range. Suitable precursors may include 6,13-dihydro-6,13-(2,3,4,5-tetrachloro-2,4-cyclohexadieno)-pentacene (202) to form, for example, pentacene (204) as the semiconductor and 6,13-pentacenequinone (206) as an insulator. A device made in accordance with the method is also included.

Abstract: The invention provides a method of filing a PDLC cell, a polymerizable mixture suitable for this purpose as well as a display device provided with such a PDLC cell. The mixture in accordance with the invention comprises two types of non-volatile reactive monomers, the first type of monomer being readily miscible with liquid crystalline material and the second type of monomer being poorly miscible with the liquid crystalline material. Such mixtures prove to be very stable. In addition, when such mixtures are used in cells, problems regarding compositional drift do not occur. Cells in which the inventive mixture is used demonstrate a relatively low hysteresis as well as a relatively low switching voltage. By virtue thereof, it is very attractive to use these cells in a display device.

Abstract: The invention provides a method of filling a PDLC cell, a polymerizable mixture suitable for this purpose as well as a display device provided with such a PDLC cell. The mixture in accordance with the invention comprises two types of non-volatile reactive monomers, the first type of monomer being readily miscible with liquid crystalline material and the second type of monomer being poorly miscible with the liquid crystalline material. Such mixtures prove to be very stable. In addition, when such mixtures are used in cells, problems regarding compositional drift do not occur. Cells in which the inventive mixture is used demonstrate a relatively low hysteresis as well as a relatively low switching voltage. By virtue thereof, it is very attractive to use these cells in a display device.

Abstract: The invention relates to a method of manufacturing an optical component. In this method, a substrate, for example of glass, is successively provided with an orientation layer and an optically anisotropic layer of a material containing monomers which are provided with at least one covalently bonded reactive group, whereafter the optically anisotropic layer is polymerized. In accordance with the present invention, the applied orientation layer also comprises covalently bonded reactive groups. As a result, a good adhesion between the optically anisotropic layer and the orientation layer of the substrate is achieved. This has a favorable effect on the optical quality of the component. For the reactive groups use is preferably made of (meth)acrylate compounds which are polymerized by exposing them to radiation. Good results are achieved if for the orientation layer use is predominantly made of polyimide with covalently bonded reactive groups.

Abstract: Method of preparing a composite material comprising a silica network and chains of a polyhydroxy compound which are interwoven therewith and a liquid crystal display device having a top coat of such a composite material.A description is given of a method of preparing a composite material comprising a silica network and, interwoven therewith, chains of, for example, polyhydroxyalkyl acrylate, by first photopolymerizing a tetraalkenyl orthosilicate with UV-light and subsequently converting it into the composite material by subjecting it to a sol-gel treatment. The material obtained is optically transparent. In addition, the material exhibits very little shrinkage so that it can be deposited on a substrate in relatively thick layers. The composite material is very suitable for a top coat 5 on a color-filter layer 3 in a liquid crystal display device because, inter alia, it adheres well to the ITO layer 7.

Abstract: The invention relates to a method of manufacturing a semiconductor device, in which methylated silyloxy groups are formed on a silicon oxide layer which protects a PN junction, the methylated silyloxy groups being formed to reduce the leakage current of the device.The method employs a solution in which an amine is present which is at least di-substituted.