Patents by Inventor Frederik Hendrik In't Veld

Frederik Hendrik In't Veld has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device for separating electronic components
    Patent number: 8813349
    Abstract: A device for separating electronic components including sawing means and positioning means, wherein between the positioning means and the sawing means at least one transfer position is defined for the purpose of transferring positioned electronic components. A separating device for electronic components including sawing means, positioning means, inspection means, and sorting means, wherein between the positioning means and the sawing means at least one transfer position is defined for the purpose of transferring positioned electronic components between the positioning means and the sawing means, and wherein between the inspection means and the sorting means at least another transfer position is defined for the purpose of transferring the inspected separated electronic components between the inspection means and the sorting means.
    Type: Grant
    Filed: July 9, 2009
    Date of Patent: August 26, 2014
    Assignee: FICO B.V.
    Inventors: Frederik Hendrik In 'T Veld, Mark Hermans, Wilhelmus Hendrikus Johannes Harmsen, Johannes Gerhardus Augustinus Zweers
  • Methods for separating electronic components utilizing a manipulator to transport the electronic components between first and second cutting tools
    Patent number: 8677592
    Abstract: The invention relates to a method for separating electronic components, comprising the processing steps of placing an assembly of electronic components on a manipulator, transporting the electronic components with the manipulator along a first cutting tool such that the assembly is cut through only partially along cutting lines in the thickness direction thereof, and transporting the partially severed assembly with a manipulator along a second cutting tool such that the cutting lines are severed almost completely. The invention also relates to a device for separating electronic components, and to a separated electronic component obtainable with the method.
    Type: Grant
    Filed: September 19, 2006
    Date of Patent: March 25, 2014
    Assignee: Fico B.V.
    Inventors: Frederik Hendrik In't Veld, Joannes Leonardus Jurrian Zijl, Hendrik Wensink
  • Device and Method for Sawing Electronic Components
    Publication number: 20110197727
    Abstract: The invention relates to a device for separating electronic components, provided with: sawing means and positioning means, wherein between the positioning means and the sawing means at least one transfer position is defined for the purpose of transferring positioned electronic components. The invention further comprises a separating device for electronic components, provided with: sawing means, inspection means, and sorting means, wherein between the inspection means and the sorting means at least one transfer position is defined for the purpose of transferring separated electronic components. Finally, the invention also relates to a method for separating electronic components.
    Type: Application
    Filed: July 9, 2009
    Publication date: August 18, 2011
    Applicant: FICO B.V.
    Inventors: Frederik Hendrik In 'T Veld, Mark Hermans, Wilhelmus Hendrikus Johannes Harmsen, Johannes Gerhardus Augustinus Zweers
  • Device and Method for Separating Electronic Components
    Publication number: 20080289165
    Abstract: The invention relates to a method for separating electronic components, comprising the processing steps of placing an assembly of electronic components on a manipulator, transporting the electronic components with the manipulator along a first cutting tool such that the assembly is cut through only partially along cutting lines in the thickness direction thereof, and transporting the partially severed assembly with a manipulator along a second cutting tool such that the cutting lines are severed almost completely. The invention also relates to a device for separating electronic components, and to a separated electronic component obtainable with the method.
    Type: Application
    Filed: September 19, 2006
    Publication date: November 27, 2008
    Applicant: Fico Singulation B.V.
    Inventors: Frederik Hendrik In't Veld, Joannes Leonardus Jurrian Zijl, Hendrik Wensink
  • Substrate and method of separating components from a substrate
    Patent number: 7134582
    Abstract: A substrate (1) having a first groove (4) is provided with a protrusion (3) on the first groove (4). This protrusion (4) preferably has a top with an apex angle of 30 to 150 degrees and results in a controlled breaking of the substrate (1) and a minimum of loss due to deviations of the crack initiated at the protrusion (4).
    Type: Grant
    Filed: May 27, 2002
    Date of Patent: November 14, 2006
    Assignee: Koninklijke Philips Electronics N. V.
    Inventors: Petrus Cornelis Paulus Bouten, Frederik Hendrik In't Veld, Roger Maria Helmut Godfried Wehrens
  • Method and apparatus for manufacturing a packaged semiconductor device, packaged semiconductor device obtained with such a method and metal carrier suitable for use in such a method
    Patent number: 7115443
    Abstract: The invention relates to a method of manufacturing a packaged semiconductor device comprising subjecting a metal carrier provided with at least one semiconductor crystal, the semiconductor crystal being provided with an encapsulation, to a singulation step in a dicing apparatus that is provided with a dicing blade comprising diamond grains, in which singulation step the dicing blade cuts, while being cooled with a cooling fluid, through the encapsulation and the metal carrier so as to singulate the at least one semiconductor device, characterized by applying a friction force reducing cooling fluid during the singulation step.
    Type: Grant
    Filed: July 31, 2003
    Date of Patent: October 3, 2006
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Frederik Hendrik In't Veld, Johannes Hermanus Savenije
  • Substrate and method of separating components from a substrate
    Publication number: 20040144824
    Abstract: A substrate (1) having a first groove (4) is provided with a protrusion (3) on the first groove (4). This protrusion (4) preferably has a top with an apex angle of 30 to 150 degrees and results in a controlled breaking of the substrate (1) and a minimum of loss due to deviations of the crack initiated at the protrusion (4).
    Type: Application
    Filed: November 24, 2003
    Publication date: July 29, 2004
    Inventors: Petrus Cornelis Paulus Bouten, Frederik Hendrik In't Veld, Roger Maria Helmut Godfried Wehrens