Abstract: A nozzle assembly (314) for directing flow of fluid across one or more semiconductor device cutting blades (318), comprising: one or more nozzles configured to protrude toward a cutting blade for cutting a semiconductor device; and a channel formed in each of the nozzles, the channel being configured to at least partially surround the cutting blade, so as to simultaneously direct flow of a fluid onto the cutting edge of the cutting blade and onto the sides of the cutting blade.

Abstract: A substrate (1) having a first groove (4) is provided with a plurality of protrusions (3) on the first groove (4). These protrusions (4) can have a top with an apex angle of 30 to 150 degrees and results in a controlled breaking of the substrate (1) and a minimum of loss due to deviations of the crack initiated at the protrusion (4).

Abstract: The invention relates to a method of manufacturing a packaged semiconductor device comprising subjecting a metal carrier provided with at least one semiconductor crystal, the semiconductor crystal being provided with an encapsulation, to a singulation step in a dicing apparatus that is provided with a dicing blade comprising diamond grains, in which singulation step the dicing blade cuts, while being cooled with a cooling fluid, through the encapsulation and the metal carrier so as to singulate the at least one semiconductor device, characterized by applying a friction force reducing cooling fluid during the singulation step.