Patents by Inventor Frederik In'tveld

Frederik In'tveld has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070175304
    Abstract: A nozzle assembly (314) for directing flow of fluid across one or more semiconductor device cutting blades (318), comprising: one or more nozzles configured to protrude toward a cutting blade for cutting a semiconductor device; and a channel formed in each of the nozzles, the channel being configured to at least partially surround the cutting blade, so as to simultaneously direct flow of a fluid onto the cutting edge of the cutting blade and onto the sides of the cutting blade.
    Type: Application
    Filed: February 23, 2005
    Publication date: August 2, 2007
    Applicant: KONINKLIJKE PHILIPS ELECTRONICS, N.V.
    Inventors: Frederik In't Veld, Atapol Pprajukamol, Johannes Savenije
  • Publication number: 20070072395
    Abstract: A substrate (1) having a first groove (4) is provided with a plurality of protrusions (3) on the first groove (4). These protrusions (4) can have a top with an apex angle of 30 to 150 degrees and results in a controlled breaking of the substrate (1) and a minimum of loss due to deviations of the crack initiated at the protrusion (4).
    Type: Application
    Filed: September 13, 2006
    Publication date: March 29, 2007
    Applicant: KONINKLIJKE PHILIPS ELECTRONICS, N.V.
    Inventors: Petrus Bouten, Frederik In't Veld, Roger Wehrens
  • Publication number: 20050255630
    Abstract: The invention relates to a method of manufacturing a packaged semiconductor device comprising subjecting a metal carrier provided with at least one semiconductor crystal, the semiconductor crystal being provided with an encapsulation, to a singulation step in a dicing apparatus that is provided with a dicing blade comprising diamond grains, in which singulation step the dicing blade cuts, while being cooled with a cooling fluid, through the encapsulation and the metal carrier so as to singulate the at least one semiconductor device, characterized by applying a friction force reducing cooling fluid during the singulation step.
    Type: Application
    Filed: July 31, 2003
    Publication date: November 17, 2005
    Inventors: Frederik In'tveld, Johannes Savenije