Abstract: A method for introducing species into a strained semiconductor layer comprising: providing a substrate comprising a first region comprising an exposed strained semiconductor layer, loading the substrate in a reaction chamber, then forming a conformal first species containing-layer by vapor phase deposition (VPD) at least on the exposed strained semiconductor layer, and thereafter performing a thermal treatment, thereby diffusing at least part of the first species from the first species-containing layer into the strained semiconductor layer and activating at least part of the diffused first species in the strained semiconductor layer.

Abstract: A method for introducing species into a strained semiconductor layer comprising: providing a substrate comprising a first region comprising an exposed strained semiconductor layer, loading the substrate in a reaction chamber, then forming a conformal first species containing-layer by vapor phase deposition (VPD) at least on the exposed strained semiconductor layer, and thereafter performing a thermal treatment, thereby diffusing at least part of the first species from the first species-containing layer into the strained semiconductor layer and activating at least part of the diffused first species in the strained semiconductor layer.

Abstract: A method for introducing species into a strained semiconductor layer comprising: providing a substrate comprising a first region comprising an exposed strained semiconductor layer, loading the substrate in a reaction chamber, then forming a conformal first species containing-layer by vapor phase deposition (VPD) at least on the exposed strained semiconductor layer, and thereafter performing a thermal treatment, thereby diffusing at least part of the first species from the first species-containing layer into the strained semiconductor layer and activating at least part of the diffused first species in the strained semiconductor layer.

Abstract: A method for introducing species into a strained semiconductor layer comprising: providing a substrate comprising a first region comprising an exposed strained semiconductor layer, loading the substrate in a reaction chamber, then forming a conformal first species containing-layer by vapor phase deposition (VPD) at least on the exposed strained semiconductor layer, and thereafter performing a thermal treatment, thereby diffusing at least part of the first species from the first species-containing layer into the strained semiconductor layer and activating at least part of the diffused first species in the strained semiconductor layer.

Abstract: A method for forming at least one quantum dot at at least one predetermined location on a substrate is disclosed. In one aspect, the method comprises providing a layer of semiconductor material on an insulating layer on the substrate. The layer of semiconductor material is patterned so as to provide at least one line of semiconductor material having a width (wL) and having a local width variation at at least one predetermined location where the at least one quantum dot has to be formed. The local width variation has an amplitude (A) of between about 20 nm and 35 nm higher than the width wL of the at least one line. The at least one line is patterned to form at least one quantum dot. A design for a lithographic mask for use with the method and a method for making such a design are also disclosed.

Abstract: A method for forming at least one quantum dot at least one predetermined location on a substrate is disclosed. In one aspect, the method comprises providing a layer of semiconductor material on an insulating layer on the substrate. The layer of semiconductor material is patterned so as to provide at least one line of semiconductor material having a width (wL) and having a local width variation at least one predetermined location where the at least one quantum dot has to be formed. The local width variation has an amplitude (A) of between about 20 nm and 35 nm higher than the width wL of the at least one line. The at least one line is patterned to form at least one quantum dot. A design for a lithographic mask for use with the method and a method for making such a design are also disclosed.

Abstract: A method of producing a semiconductor device using a selective epitaxial growth (SEG) process is disclosed. In one aspect, the method comprises providing a semiconductor substrate, forming a pattern of an insulation material on the semiconductor substrate, thereby defining a covered and non covered surface, performing a cleaning processing of the covered and non covered surface of the substrate having the insulating pattern defined, loading the substrate with the insulating pattern into a reaction chamber of an epitaxial reactor, and starting a selective epitaxial growth comprising an injection of at least one semiconductor source gas possibly with at least one first carrier gas in the reaction chamber of the epitaxial reactor. The method further comprises, prior to the selective epitaxial growth, the surface of the substrate is subjected in the reaction chamber to an in situ pre-treatment with the injection of a halogen containing etching gas possibly with a second carrier gas.

Abstract: The present invention is related to a method for making a passivated semiconductor substrate comprising the steps of providing a substrate surface comprising or consisting of mono-crystalline semiconductor material other than silicon and forming a silicon layer on the substrate surface, such that the silicon layer is substantially lattice matched to the mono-crystalline semiconductor material. It is also related to a semiconductor substrate passivated according to the method.