Abstract: A coil is produced by winding a wire that is clad with an electrical insulation so as to form a coil bundle of successive windings. The coil bundle has at least one first winding formed by a first end section of the wire and at least one second winding formed by a second end section of the wire. A portion of the electrical insulation of the at least one first winding is removed to expose a portion of the first end section of the wire for forming a first electrical contact of the coil, and a portion of the electrical insulation of the at least one second winding is removed to expose a portion of the second end section of the wire for forming said second electrical contact of the coil. There is also described a coil.

Abstract: A coil is produced by winding a wire that is clad with an electrical insulation so as to form a coil bundle of successive windings. The coil bundle has at least one first winding formed by a first end section of the wire and at least one second winding formed by a second end section of the wire. A portion of the electrical insulation of the at least one first winding is removed to expose a portion of the first end section of the wire for forming a first electrical contact of the coil, and a portion of the electrical insulation of the at least one second winding is removed to expose a portion of the second end section of the wire for forming said second electrical contact of the coil. There is also described a coil.

Abstract: An electronic device, in particular for a medical implant, and a printed circuit board arrangement including a printed circuit board, wherein at least one UV-transparent element is at least fixedly coupled to the printed circuit board, wherein the UV-transparent element is intended for fixation of the printed circuit board in an electronic device.

Abstract: Terminal pin for electrically connecting a carrier of electrical leads or an electronic component by means of a solder connection between the carrier or component and the terminal pin, wherein an end of a pin body is provided with a swaged cap of a material which is harder than the material of the pin body and which has an outer surface which is suitable for making the solder connection, wherein the cap has an inner circumferential edge where the cap is at least locally narrowed to inside of the outer circumference of the pin body, and wherein there is no additional material between the pin body and the cap.

Abstract: An electronic device, in particular for a medical implant, and a printed circuit board arrangement including a printed circuit board, wherein at least one UV-transparent element is at least fixedly coupled to the printed circuit board, wherein the UV-transparent element is intended for fixation of the printed circuit board in an electronic device.

Abstract: The present invention refers to a die (1) with an improved crack detecting structure for a predefined area of the die comprising an electrical conductive path (5,6) laid along a perimeter of the predefined area and a first bond pad (17a) at the first end of the path (5, 6) and a second bond pad (17b) at the second end of the path (5, 6), wherein the electrical conductive path (5,6) contains at least one first path section (12) disposed at the front side of the die (1) and at least one second path section (13) disposed at the back side of the die (1), wherein the at least one first path section (12) and the at least one second path section (13) are coupled by at least one through connection (14). Further, the invention refers to a respective system on package and methods for manufacturing a respective die or a respective system on package.

Abstract: Terminal pin for electrically connecting a carrier of electrical leads or an electronic component by means of a solder connection between the carrier or component and the terminal pin, wherein an end of a pin body is provided with a swaged cap of a material which is harder than the material of the pin body and which has an outer surface which is suitable for making the solder connection, wherein the cap has an inner circumferential edge where the cap is at least locally narrowed to inside of the outer circumference of the pin body, and wherein there is no additional material between the pin body and the cap.

Abstract: The present invention refers to a sensor unit (10, 10?) for an electronic module (1) which is small and lightweight comprising at least one exposed component (5, 5 a, 5b) containing a chemical element and/or a chemical compound at its surface which is adapted to undergo a color change observed in visible light due to presence of a corrosive, the exposed component preferably containing elementary copper. The invention further refers to a respective electronic module (1) and a procedure to calculate the level of corrosive exposure of such an electronic module (1).

Abstract: A flexible circuit board for producing a flexible-rigid circuit board composite made of at least one flexible circuit board and at least one rigid circuit board, the at least one flexible circuit board having at least one first planar segment, which interacts as intended in the installed state with at least one second planar segment of the at least one rigid circuit board, wherein the at least one first planar segment comprises at least one flexible connecting element, which is elastically connected to a face of the at least one first planar segment. Furthermore, a flexible-rigid circuit board composite is provided having at least one flexible circuit board, a flexible-rigid circuit board arrangement, and a method and a device for producing a flexible-rigid circuit board composite.

Abstract: An integrated interconnect tab that provides a mechanically repeatable connection point to electrical components mounted on a printed circuit board. The integrated interconnect tab comprises a conductive pad surrounded by a vertical sidewall structure formed in an overmolded insulating layer. In one embodiment, a large pad accommodates connections to high-power circuit elements such as batteries and high-voltage capacitors. The sidewall structure helps align and guide the position of an interconnecting device such as a wire ribbon connector, facilitating automation of a subsequent attachment process. An automated method of making a PCB assembly having integrated interconnect tabs entails attaching circuit elements and interconnect tabs to a surface of a PCB substrate, encapsulating the attached components, and selectively machining the encapsulating layer to expose weld tabs, to form the vertical sidewall structure surrounding the tabs, and to create mechanical retention features to aid in welding.

Abstract: A flexible circuit board for producing a flexible-rigid circuit board composite made of at least one flexible circuit board and at least one rigid circuit board, the at least one flexible circuit board having at least one first planar segment, which interacts as intended in the installed state with at least one second planar segment of the at least one rigid circuit board, wherein the at least one first planar segment comprises at least one flexible connecting element, which is elastically connected to a face of the at least one first planar segment. Furthermore, a flexible-rigid circuit board composite is provided having at least one flexible circuit board, a flexible-rigid circuit board arrangement, and a method and a device for producing a flexible-rigid circuit board composite.

Abstract: An integrated interconnect tab that provides a mechanically repeatable connection point to electrical components mounted on a printed circuit board. The integrated interconnect tab comprises a conductive pad surrounded by a vertical sidewall structure formed in an overmolded insulating layer. In one embodiment, a large pad accommodates connections to high-power circuit elements such as batteries and high-voltage capacitors. The sidewall structure helps align and guide the position of an interconnecting device such as a wire ribbon connector, facilitating automation of a subsequent attachment process. An automated method of making a PCB assembly having integrated interconnect tabs entails attaching circuit elements and interconnect tabs to a surface of a PCB substrate, encapsulating the attached components, and selectively machining the encapsulating layer to expose weld tabs, to form the vertical sidewall structure surrounding the tabs, and to create mechanical retention features to aid in welding.

Abstract: An apparatus and method for switching optical signal is disclosed. An optical signal switch array includes a plurality of optical switches, each optical switch having a first trench adapted to hold index-matching fluid, and a second trench adapted to hold the index-matching fluid, but initially containing gas, the second trench connected to said first trench. A first expansion chamber is connected to the first trench, the first expansion chamber adapted to hold gas. A second expansion chamber is connected to the second trench, the second expansion chamber adapted to hold gas. To effect switching, the first expansion chamber is heated expanding gas in the first expansion chamber, the expanding gas shifting the index-matching fluid in the first trench to the second trench. Bistability is achieved by the use of capillary action, which passively holds the droplet of working fluid in either of two stable states until actuation.

Abstract: An apparatus and method for switching optical signal is disclosed. An optical signal switch array includes a plurality of optical switches, each optical switch having a first trench adapted to hold index-matching fluid, and a second trench adapted to hold the index-matching fluid, but initially containing gas, the second trench connected to said first trench. A first expansion chamber is connected to the first trench, the first expansion chamber adapted to hold gas. A second expansion chamber is connected to the second trench, the second expansion chamber adapted to hold gas. To effect switching, the first expansion chamber is heated expanding gas in the first expansion chamber, the expanding gas shifting the index-matching fluid in the first trench to the second trench. Bistability is achieved by the use of capillary action, which passively holds the droplet of working fluid in either of two stable states until actuation.

Abstract: A method of determining a feature-forming variant, such as focus or exposure, for a lithographic system or the like includes Fourier processing that extracts a figure of merit. In a preferred embodiment, the lithographic system fabricates a series of formations of a single pattern. An optical image of each exposure is formed. A Fourier power spectrum is determined for each optical image. An angular power function is extracted from each power spectrum by quantifying optical power along lines originating at various angles from an origin of the power spectrum. With regard to axes of maximum power, the distribution of on-axes and off-axes power is quantified for each angular power function. An optimum for the lithographic system is determined based upon the data extracted from the angular power functions.

Abstract: Reticle data used to form a reticle pattern is modified to substantially compensate for proximity effects resulting from the diffraction of light by opaque portions of the reticle pattern.The reticle pattern is thus modified so that the exposed pattern on the wafer results in a desired pattern, wherein isolated features and features in a dense pattern of features formed on the wafer will be identical and have predictable characteristics.

Abstract: A method for locating the signal from a fiducial mark which is separated by a known distance from a second fiducial mark is disclosed. The signals from the fiducial marks are presumed to be corrupted by noise. The method utilizes the known spacing of the fiducial marks to construct a filter function which, when convolved with the corrupted signal, produces an enhanced signal having a peak at the location of the fiducial mark.