Patents by Inventor Frederik W. M. Vanhelmont

Frederik W. M. Vanhelmont has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8058768
    Abstract: A bulk acoustic wave, BAW, resonator device comprising first and second metal layers (10, 20) and an intervening piezoelectric layer (30), the first metal layer (10) comprising spaced first and second portions (12, 14), wherein the first and second portions (12, 14) are each arranged as a plurality of interconnected fingers (16, 18), and wherein each of the plurality of fingers (16) of the first portion (12) is acoustically coupled to at least one of the fingers (18) of the second portion (14). In one embodiment the fingers of the first portion (12) are interlaced with the fingers (18) of the second portion (14), thereby providing direct coupling. In another embodiment the acoustic coupling between the fingers of the first and second portions is provided indirectly by further portions (15) of the first metal layer (10).
    Type: Grant
    Filed: May 23, 2006
    Date of Patent: November 15, 2011
    Assignee: Triquint Semiconductor, Inc.
    Inventors: Robert F. Milsom, Frederik W. M. VanHelmont, Andreas B. M. Jansman, Jaap Ruigrok, Hans-Peter Loebl
  • Patent number: 7847649
    Abstract: The invention relates to a MEMS resonator comprising a movable element (48), the movable element (48) comprising a first part (A) having a first Young's modulus and a first temperature coefficient of the first Young's modulus, and the movable element (48) further comprising a second part (B) having a second Young's modulus and a second temperature coefficient of the second.
    Type: Grant
    Filed: December 18, 2006
    Date of Patent: December 7, 2010
    Assignee: NXP B.V.
    Inventors: Jozef T. M. Van Beek, Hans-Peter Loebl, Frederik W. M. Vanhelmont
  • Publication number: 20100039000
    Abstract: A bulk acoustic wave, BAW, resonator device comprising first and second metal layers (10, 20) and an intervening piezoelectric layer (30), the first metal layer (10) comprising spaced first and second portions (12, 14), wherein the first and second portions (12, 14) are each arranged as a plurality of interconnected fingers (16, 18), and wherein each of the plurality of fingers (16) of the first portion (12) is acoustically coupled to at least one of the fingers (18) of the second portion (14). In one embodiment the fingers of the first portion (12) are interlaced with the fingers (18) of the second portion (14), thereby providing direct coupling. In another embodiment the acoustic coupling between the fingers of the first and second portions is provided indirectly by further portions (15) of the first metal layer (10).
    Type: Application
    Filed: May 23, 2006
    Publication date: February 18, 2010
    Applicant: NXP B.V.
    Inventors: Robert F. Milson, Frederik W., M. Vanhelmont, Andreas B., M. Jansman, Jaap Ruigrok, Hans-Peter Loebl
  • Publication number: 20090219104
    Abstract: The invention relates to a MEMS resonator comprising a movable element (48), the movable element (48) comprising a first part (A) having a first Young's modulus and a first temperature coefficient of the first Young's modulus, and the movable element (48) further comprising a second part (H) having a second Young's modulus and a second temperature coefficient of the second.
    Type: Application
    Filed: December 18, 2006
    Publication date: September 3, 2009
    Applicant: NXP B.V.
    Inventors: Jozef T.M. Van Beek, Hans-Peter Loebl, Frederik W.M. Vanhelmont