Abstract: The invention relates to a resin bonded cut-off tool. The resin bonded cut-off tool comprises rod shaped sintered bauxite abrasives, wherein an amount of the rod shaped sintered bauxite abrasives is at least 10% to 90% by weight, based on 100% by weight of a Grinding Active Matrix (GAM) of the cut-off tool. The resin bonded cut-off tool comprises further a bonding agent in an amount of 10% to 40% by weight, based on 100% by weight of the GAM of the cut-off tool and fused and/or sintered abrasives in an amount sufficient to bring the GAM of the cut-off tool to 100% by weight.

Abstract: The invention relates to a grinding tool for machining brittle materials. The grinding tool has a core and an abrasive rim. The abrasive rim has abrasive particles embedded in a matrix. The matrix has a metallic bonding agent and possibly also a polymeric bonding agent. The metallic bonding agent contains silicon nitride in an amount that constitutes 0.02%-5.0% by volume of the metallic bonding agent. The invention also relates to a method of manufacturing the grinding tool. In the method, abrasive particles are mixed with metal powder and silicon nitride and the mixture is sintered. Polymeric powder may also be added before sintering.