Patents by Inventor Freek Egbert Van Straten

Freek Egbert Van Straten has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9911628
    Abstract: For so called film assisted molding (FAM) device processing techniques there is provided lead frame for a semiconductor device, comprising a base portion and a connection lead, said base portion arranged for mounting a semiconductor die, said connection lead comprising a horizontal portion for external connection and an angled portion for connection to said semiconductor die, wherein the angled portion has a positive angle with respect to the base portion. The connection lead may comprise a recessed portion.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: March 6, 2018
    Assignee: Ampleon Netherlands B.V.
    Inventors: Freek Egbert van Straten, Jeremy Joy Montalbo Incomio, Albertus Reijs
  • Publication number: 20170110343
    Abstract: For so called film assisted moulding (FAM) device processing techniques there is provided lead frame for a semiconductor device, comprising a base portion and a connection lead, said base portion arranged for mounting a semiconductor die, said connection lead comprising a horizontal portion for external connection and an angled portion for connection to said semiconductor die, wherein the angled portion has a positive angle with respect to the base portion. The connection lead may comprise a recessed portion.
    Type: Application
    Filed: December 28, 2016
    Publication date: April 20, 2017
    Inventors: Freek Egbert van Straten, Jeremy Joy Montalbo Incomio, Albertus Reijs
  • Patent number: 9570323
    Abstract: For so called film assisted moulding (FAM) device processing techniques there is provided lead frame for a semiconductor device, comprising a base portion and a connection lead, said base portion arranged for mounting a semiconductor die, said connection lead comprising a horizontal portion for external connection and an angled portion for connection to said semiconductor die, wherein the angled portion has a positive angle with respect to the base portion. The connection lead may comprise a recessed portion.
    Type: Grant
    Filed: September 4, 2014
    Date of Patent: February 14, 2017
    Assignee: Ampleon Netherlands B.V.
    Inventors: Freek Egbert van Straten, Jeremy Joy Montalbo Incomio, Albertus Reijs
  • Patent number: 9190350
    Abstract: For so called film assisted moulding (FAM) device processing techniques there is provided lead frame for a semiconductor device, comprising a base portion and a connection lead, said base portion arranged for mounting a semiconductor die, said connection lead comprising a horizontal portion for external connection and an angled portion for connection to said semiconductor die, wherein the angled portion has a positive angle with respect to the base portion. The connection lead may comprise a recessed portion.
    Type: Grant
    Filed: September 5, 2014
    Date of Patent: November 17, 2015
    Assignee: NXP B.V.
    Inventors: Freek Egbert van Straten, Jeremy Joy Montalbo Incomio, Albertus Reijs
  • Patent number: 9184469
    Abstract: A battery comprises a carrier foil, with solid state battery elements spaced along the foil and mounted on opposite sides of the foil in pairs, with the battery elements of a pair mounted at the same position along the foil. The carrier foil is folded to define a meander pattern with battery element pairs that are adjacent each other along the foil arranged back to back.
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: November 10, 2015
    Assignee: NXP B.V.
    Inventors: Friso Jacobus Jedema, Willem Frederik Adrianus Besling, Freddy Roozeboom, René Wilhelmus Johannes Maria van den Boomen, Freek Egbert van Straten
  • Publication number: 20150084174
    Abstract: For so called film assisted moulding (FAM) device processing techniques there is provided lead frame for a semiconductor device, comprising a base portion and a connection lead, said base portion arranged for mounting a semiconductor die, said connection lead comprising a horizontal portion for external connection and an angled portion for connection to said semiconductor die, wherein the angled portion has a positive angle with respect to the base portion. The connection lead may comprise a recessed portion.
    Type: Application
    Filed: September 4, 2014
    Publication date: March 26, 2015
    Inventors: Freek Egbert van Straten, Jeremy Joy Montalbo Incomio, Albertus Reijs
  • Publication number: 20150084175
    Abstract: For so called film assisted moulding (FAM) device processing techniques there is provided lead frame for a semiconductor device, comprising a base portion and a connection lead, said base portion arranged for mounting a semiconductor die, said connection lead comprising a horizontal portion for external connection and an angled portion for connection to said semiconductor die, wherein the angled portion has a positive angle with respect to the base portion. The connection lead may comprise a recessed portion.
    Type: Application
    Filed: September 5, 2014
    Publication date: March 26, 2015
    Inventors: Freek Egbert van Straten, Jeremy Joy Montalbo Incomio, Albertus Reijs
  • Patent number: 8854277
    Abstract: A millimeter-wave radio antenna module (600) comprising: an antenna substrate (603) having an antenna (602) provided on a face thereof; and a semiconductor die (601) comprising a wireless system IC, the die mounted on a face of the antenna substrate and configured to provide a signal to the antenna, wherein a ball grid array (605) is formed on a face of the antenna substrate for mounting the antenna module to a circuit board, the ball grid array being configured to define an air dielectric gap (606) between the antenna and the circuit board.
    Type: Grant
    Filed: November 16, 2009
    Date of Patent: October 7, 2014
    Assignee: NXP, B.V.
    Inventors: Antonius Johannes Matheus De Graauw, Freek Egbert Van Straten
  • Publication number: 20120116189
    Abstract: A battery comprises a carrier foil, with solid state battery elements spaced along the foil and mounted on opposite sides of the foil in pairs, with the battery elements of a pair mounted at the same position along the foil. The carrier foil is folded to define a meander pattern with battery element pairs that are adjacent each other along the foil arranged back to back.
    Type: Application
    Filed: November 2, 2011
    Publication date: May 10, 2012
    Applicant: NXP B.V.
    Inventors: Friso Jacobus Jedema, Willem Frederik Adrianus Besling, Freddy Roozeboom, René Wilhelmus Johannes Maria van den Boomen, Freek Egbert van Straten
  • Publication number: 20110285606
    Abstract: A millimetre-wave radio antenna module (600) comprising: an antenna substrate (603) having an antenna (602) provided on a face thereof; and a semiconductor die (601) comprising a wireless system IC, the die mounted on a face of the antenna substrate and configured to provide a signal to the antenna, wherein a ball grid array (605) is formed on a face of the antenna substrate for mounting the antenna module to a circuit board, the ball grid array being configured to define an air dielectric gap (606) between the antenna and the circuit board.
    Type: Application
    Filed: November 16, 2009
    Publication date: November 24, 2011
    Applicant: NXP B.V.
    Inventors: Antonius Johannes Matheus De Graauw, Freek Egbert Van Straten
  • Patent number: 7394994
    Abstract: An optical receiver circuit comprising an optical converter circuit (38), comprising a photodiode and converting optical power into electrical power, a sensor circuit for deriving a control voltage VCONTR as a characteristic value of the electrical power output by the optical converter circuit (38); and an attenuator circuit (44) having a variable attenuation, the attenuation being controlled by the characteristic value of the electrical power output by the sensor circuit so as to obtain a constant output signal level of the optical receiver circuit. An output circuit is also provided and comprises a matching network (46), an amplifier stage (48) and an output transformer (50).
    Type: Grant
    Filed: July 1, 2003
    Date of Patent: July 1, 2008
    Assignee: NXP B.V.
    Inventors: Joost Maarten Zitzmann, Freek Egbert Van Straten