Abstract: The electronic card with printed circuit (1) comprises at least one antenna with slots (AT) including a cavity (15) and a metal conductive layer (17) covering the cavity and having a plurality of slots (S17). The slots form openings in the metal conductive layer. In accordance with the invention, the cavity is formed, by removal of material, in the thickness of the printed circuit. The cavity also comprises a metallisation layer (16) on the walls and the metal conductive layer is formed in a plate attached on the electronic card with printed circuit and closes the cavity.

Abstract: The invention relates to a modular element (2) comprising a stratification of first and second electroconductive plates (PH2, PB2) which are separated by an intermediate dielectric layer (CD2) and at least one electronic power switching chip (CP1, CP2) which is implanted between the first and second plates, the chip having a upper face comprising a first power electrode and a switching control electrode and a lower face comprising a second power electrode, and the first and second power electrodes being in electrical continuity respectively with the first and second plates.

Abstract: The assembly of bus bars according to the invention comprises a plurality of sectors of bus bars (S1 to S6) which are arranged, in a connected manner and with electrical contact, around a central axis (C) and upper and lower closing plates (BPD) which are perpendicular to the central axis, the sectors of bus bars each comprising an external portion of bus bar (B11 to B16) and at least one internal portion of bus bar (B21 to B26, B31 to B36) which delimit a plurality of internal volumes, the upper and lower closing plates being in contact against upper and lower faces of the portions of bus bar, respectively, and the portions of bus bar comprising a plurality of electrical contact faces of the type referred to as “press pack”.

Abstract: The power module comprises an electronic board (EB), in which at least one power switching branch is integrated, a capacitor (CE) and at least three DC power supply busbars (B1, B2, B3), wherein the electronic board is mounted between a first busbar (B1) and a second busbar (B2) and the capacitor is mounted between the second busbar (B2) and a third busbar (B3) and the electronic board, the capacitor and the busbars comprise electric contact faces allowing assembly, of the “press pack” type, of the electronic board and of the capacitor.

Abstract: The method comprises the steps of 1) producing first and second blanks (EB1, EB2) by laminating insulating and conductive inner layers (PP, CP, E1) on copper plates forming a base (MB1, MB2), at least one electronic chip (MT, MD) being sandwiched between the blanks, said blanks being produced such that their upper lamination surfaces have matching profiles, 2) stacking and fitting the blanks via their matching profiles, and 3) press-fitting the blanks to form a laminated sub-assembly for an integrated power electronics device. The method uses IMS-type techniques.

Abstract: The invention relates to a modular element (2) comprising a stratification of first and second electroconductive plates (PH2, PB2) which are separated by an intermediate dielectric layer (CD2) and at least one electronic power switching chip (CP1, CP2) which is implanted between the first and second plates, the chip having a upper face comprising a first power electrode and a switching control electrode and a lower face comprising a second power electrode, and the first and second power electrodes being in electrical continuity respectively with the first and second plates.

Abstract: The electronic card with printed circuit comprises at least one diffraction structure (DS) having a cavity (15) and a diffraction plate (17). In accordance with the invention, the diffraction structure is incorporated in the thickness of the electronic card with printed circuit, the cavity being formed, by removal of material, in the thickness of the electronic card with printed circuit and the diffraction plate being formed in a plate which is arranged on the electronic card with printed circuit and closes the cavity.

Abstract: The assembly of bus bars according to the invention comprises a plurality of sectors of bus bars (S1 to S6) which are arranged, in a connected manner and with electrical contact, around a central axis (C) and upper and lower closing plates (BPD) which are perpendicular to the central axis, the sectors of bus bars each comprising an external portion of bus bar (B11 to B16) and at least one internal portion of bus bar (B21 to B26, B31 to B36) which delimit a plurality of internal volumes, the upper and lower closing plates being in contact against upper and lower faces of the portions of bus bar, respectively, and the portions of bus bar comprising a plurality of electrical contact faces of the type referred to as “press pack”.

Abstract: The power module comprises an electronic board (EB), in which at least one power switching branch is integrated, a capacitor (CE) and at least three DC power supply busbars (B1, B2, B3), wherein the electronic board is mounted between a first busbar (B1) and a second busbar (B2) and the capacitor is mounted between the second busbar (B2) and a third busbar (B3) and the electronic board, the capacitor and the busbars comprise electric contact faces allowing assembly, of the “press pack” type, of the electronic board and of the capacitor.

Abstract: The circuit comprises at least one electronic chip (MT, MD), a laminated substrate and heat sink means, the chip being implanted in the substrate and the heat sink means being secured to opposing faces of the substrate. According to the invention, the heat sink means comprise heat-sink-forming bus-bars (BBH, BBL) mounted on the opposing faces of the substrate, each of said bus-bars being formed by a plurality of metal segments (BB1H, BB2H, BB3H, BB4H; BB1L, BB2L, BB3L) secured at spaced-apart positions and interconnected with one another and with a contact face of the electronic chip (MT, MD) by means of a metal layer (MEH, MEL).

Abstract: The method for producing a preform integrating at least one electronic chip included between insulating and/or conductive laminated internal layers; mechanically securing metal bus-bar segments at given spaced-apart positions on opposing upper and lower faces of the preform, using dielectric portions of a resin prepreg; and for each of the upper and lower opposing faces, electrodepositing a metal layer in order to interconnect bus-bar segments secured to the face in question and an electrode of the electronic chip, thereby forming an electronic power circuit comprising bus-bars forming heat sinks.

Abstract: The method comprises the steps of 1) producing first and second blanks (EB1) including reserved-space defining means (HM1, HM2), by laminating insulating and conductive inner layers (PP, CP) on copper plates forming a base (MB1), at least one electronic chip being sandwiched between the blanks, said blanks being produced such that their upper lamination surfaces have matching profiles, 2) stacking and fitting the blanks via their matching profiles, and 3) press-fitting the blanks to form a laminated sub-assembly for an integrated power electronics device. The method uses IMS-type techniques.

Abstract: The power switching module includes first and second subassemblies that are superimposed on top of each other to form a stack and that comprise first and second electronic power switches forming a bridging arm, respectively. The module comprises a metal central sheet (LW7) and first and second metal end sheets (LW2, LW12) forming top and bottom ends of the stack. According to the invention, the module also comprises first, second and third metal terminal rods (1, 2, 3) that extend through the stack and open onto at least one of the top and bottom ends thereof, the first, second and third rods being in electrical continuity with the first and second metal end sheets and the metal central sheet, respectively.

Abstract: The method detects a fault in a power switching electronic device (OT1) by using the thermo-acoustic effect and comprises the steps of: a) detecting an acoustic signal (SA) generated by thermo-acoustic effect in the electronic device when it is in operation; determining (FFT) a frequency spectrum of the detected acoustic signal and obtaining, from the frequency spectrum, a spectral signature (SEP) associated with the detected acoustic signal; comparing (CSG) the spectral signature (SEP) with a plurality of reference spectral signatures (Sgn); and, deciding (CSG) on the presence of at least one fault in the electronic device when at least one coincidence is identified in the comparison step c) between the spectral signature and the plurality of reference spectral signatures.

Abstract: The method comprises the steps of 1) producing first and second blanks (EB1) including reserved-space defining means (HM1, HM2), by laminating insulating and conductive inner layers (PP, CP) on copper plates forming a base (MB1), at least one electronic chip being sandwiched between the blanks, said blanks being produced such that their upper lamination surfaces have matching profiles, 2) stacking and fitting the blanks via their matching profiles, and 3) press-fitting the blanks to form a laminated sub-assembly for an integrated power electronics device. The method uses IMS-type techniques.

Abstract: The circuit comprises at least one electronic chip (MT, MD), a laminated substrate and heat sink means, the chip being implanted in the substrate and the heat sink means being secured to opposing faces of the substrate. According to the invention, the heat sink means comprise heat-sink-forming bus-bars (BBH, BBL) mounted on the opposing faces of the substrate, each of said bus-bars being formed by a plurality of metal segments (BB1H, BB2H, BB3H, BB4H; BB1L, BB2L, BB3L) secured at spaced-apart positions and interconnected with one another and with a contact face of the electronic chip (MT, MD) by means of a metal layer (MEH, MEL).

Abstract: The power switching module includes first and second subassemblies that are superimposed on top of each other to form a stack and that comprise first and second electronic power switches forming a bridging arm, respectively. The module comprises a metal central sheet (LW7) and first and second metal end sheets (LW2, LW12) forming top and bottom ends of the stack. According to the invention, the module also comprises first, second and third metal terminal rods (1, 2, 3) that extend through the stack and open onto at least one of the top and bottom ends thereof, the first, second and third rods being in electrical continuity with the first and second metal end sheets and the metal central sheet, respectively.

Abstract: The electronic card with printed circuit (1) comprises at least one antenna with slots (AT) including a cavity (15) and a metal conductive layer (17) covering the cavity and having a plurality of slots (S17). The slots form openings in the metal conductive layer. In accordance with the invention, the cavity is formed, by removal of material, in the thickness of the printed circuit. The cavity also comprises a metallisation layer (16) on the walls and the metal conductive layer is formed in a plate attached on the electronic card with printed circuit and closes the cavity.

Abstract: The electronic card with printed circuit comprises at least one diffraction structure (DS) having a cavity (15) and a diffraction plate (17). In accordance with the invention, the diffraction structure is incorporated in the thickness of the electronic card with printed circuit, the cavity being formed, by removal of material, in the thickness of the electronic card with printed circuit and the diffraction plate being formed in a plate which is arranged on the electronic card with printed circuit and closes the cavity.

Abstract: The panel comprises a plurality of spiraled active elements (11re) and is produced in a stratified form, each of the active elements comprising an active area (11AV) with a spiral-shaped active conductive strip (110). The active area is formed on a first face of the panel which is of multilayer type and comprises at least one dielectric layer and one conductive layer. Each of the active elements includes a magnetic shielding plate (112r) covering a back face of the active area.