Abstract: A testing apparatus for components which are tested using an electric or an ion beam in a vacuum chamber overcomes seal problems by providing electrical connection to the component to be tested through a multilayer printed circuit board. The multilayer printed circuit board may be connected to a needle adapter within the vacuum chamber for providing the electrical connection to the component.

Abstract: A cooling means is provided for components situated in a vacuum chamber for function testing with focused electron or ion beams. In traditional arrangements, cooling is accomplished with a liquid-cooled metal block that is mounted in the vacuum chamber between the component and an opto-electronic column that generates the electron beam. Coolant is conducted toward the outside of the vacuum chamber via hoses. What is disadvantageous with this solution is the necessity of introducing flow-traversed tubes into the vacuum chamber. Moreover, this solution cannot be realized for components in TAB mounting. In order to avoid these disadvantages, a heat sink is introduced into the vacuum chamber via a sealed opening situated at an upper side of the vacuum chamber. This heat sink is directly contacted to a back side of the component.