Abstract: In a sensor array having a substrate and a housing, and in a method for manufacturing a sensor array are proposed, the housing substantially completely surrounds the substrate in a first substrate area, the housing is provided in a second substrate area at least partly open via an opening, and the second substrate area is provided protruding from the housing in the area of the opening.

Abstract: A module includes an electrical component having an inner enclosure which surrounds the electrical component and which has first electrical contact means at least on one outer side; having an outer enclosure in the interior of which the inner enclosure is situated, the outer enclosure having second electrical contact means, the second electrical contact means extending from the interior to at least one outer side of the outer enclosure. The first and second contact means are interconnected.

Abstract: The present invention provides a possibility of mounting conventionally capped components, that saves much space. The component assembly includes at least one component having a cap, a substrate for the component and connecting means for mounting the component on the substrate and for the electrical connection of the component. The substrate has at least one recess. The component is mounted on the substrate in flip-chip technique, so that the cap is inserted into the recess and the component is connected to the substrate via connecting bumps in the edge region of the recess.

Abstract: An electrical component includes at least one first semiconductor substrate, at least one contact means for the external contacting, and at least one bonding wire. The contact means has a first side and, diametrically opposite, a second side. The semiconductor substrate is situated on the first side of the contact means. The semiconductor substrate and the contact means are electrically conductively connected using the bonding wire and the bonding wire is connected to the contact means on the second side. A core idea is that the contact means has a recess on the second side and the bonding wire is connected to the contact means in the area of the recess.

Abstract: The present invention creates an optical sensor assemblage, in particular a thermopile sensor assemblage, comprising a sensor chip assemblage (10; 10?) having an optically transparent irradiation region (OB; OB?), a mounting region (RB; RB?) surrounding the latter, and a wire-bond region (BB); an optically isolating mounting frame (MLF; MLF?) having a chip receiving region (DP; DP?) and a plurality of connector elements (AB-AB??); and an optically isolating packaging device (MV-MV??); the sensor chip assemblage (10; 10?) being joined in the mounting region (RB; RB?) to the chip receiving region (LB; LB?), and in the wire-bond region (BB) to one or more of the connector elements (AB-AB??); the chip receiving region (DP, DP?) having a window (F; F?) disposed in such a way that at least a portion of the optical irradiation region (OB; OB?) is not covered by the chip receiving region (DP; DP?); and the packaging device (MV-MV??) surrounding the sensor chip assemblage (10; 10?) and the mounting frame (MLF; MLF?) i

Abstract: A semiconductor system or sensor system in a housing which is butt-joined to a printed circuit board by soldering, at least some of the connecting surfaces not being soldered over their entire area, the connecting surfaces which are not soldered over their entire area being fixedly soldered in a first surface region to a section of a printed conductor, and in a second surface region the connecting surfaces not being fixedly connected to the printed circuit board, the securely soldered surface regions being situated closer to the semiconductor or sensor structure to be contacted than are the surface regions which are not fixedly connected to the printed circuit board.

Abstract: A sensor system having a substrate and a housing and a method for manufacturing a sensor system are provided, the housing essentially completely enclosing the substrate in a first substrate region, the housing in a second substrate region being provided at least partially open via an opening, the second substrate region in the region of the opening being provided so as to project from the housing, the housing being manufactured using an injection molding compound and being molded in such a way that the injection molding compound has only one flow front.

Abstract: A micromechanical component has a structure such that a material flow is guided from at least one preferred direction for the purpose of uniformly enveloping the micromechanical component.

Abstract: A micromechanical component including a chip which is mounted on a substrate and has an encapsulated chip area which is higher than its vicinity, as well as a mounting area provided in the vicinity of the encapsulated chip area. The chip being mounted on the substrate by a mounting arrangement which is connected to the mounting area, so that the encapsulated chip area faces the substrate and is positioned at a distance therefrom. The encapsulated chip area is surrounded by an underfill beneath the chip. A method for the manufacture of the micromechanical component is also provided.

Abstract: A method for joining a silicon plate to a second plate, a laser beam being directed through the silicon plate at the second plate. In the process, the wavelength of the laser beam is selected in such a way that only a negligibly small amount of energy is absorbed in the silicon plate. A strongly absorbent material is hotmelted by the laser beam's energy and then produces a bond between the silicon plate and the second plate.

Abstract: A method for packaging semiconductor chips and a corresponding semiconductor chip system. The method includes making available a semiconductor chip having a diaphragm region; providing a cap over the diaphragm region, while leaving the diaphragm region open; mounting the semiconductor chip on a support frame; and providing a molded housing around the semiconductor chip and at least a partial region of the support frame for packaging the semiconductor chip.

Abstract: A device for supplying power to a tire-pressure sensor, containing a generator that is corotational with the tire and in which an electric voltage is generated by electromagnetic induction.

Abstract: A method is proposed for welding a first component part to a second component part, the energy to melt melting regions being supplied by a laser beam. In this context, the laser beam is directed through the first component part, which is made of a nonabsorbing material, to the second component part. The second component part is made of a material which strongly absorbs laser beam. At least one stop is provided outside melting regions.

Abstract: A method for producing a pressure sensor, in which a semiconductor pressure pick-up is mounted on a mounting section of a lead grid, in particular a leadframe. The semiconductor pressure pick-up is electrically connected to contact sections of the lead grid. The lead grid, together with the semiconductor pressure pick-up, is inserted into an injection molding die. A die part is brought into contact at the side of the semiconductor pressure pick-up facing away from the mounting section or at side of the mounting section facing away from the semiconductor pressure pick-up. The semiconductor pressure pick-up in the injection molding die is subsequently enclosed by a housing made of mold compound. In order to prevent the mounting section from giving way, it is proposed to clamp the mounting section of the lead grid in the injection molding die when producing the housing.

Abstract: A method is proposed for welding a first component part to a second component part, the energy to melt melting regions being supplied by a laser beam. In this context, the laser beam is directed through the first component part, which is made of a nonabsorbing material, to the second component part. The second component part is made of a material which strongly absorbs laser beam. At least one stop is provided outside melting regions.

Abstract: An electronic device, including a housing part having at least one closable opening and one plug-in part, the housing part accommodating a printed circuit board, which has at least one electrical and/or electronic component arranged thereon, and electrical contact elements, which are electrically connected to the plug-in part, and which have ends in the housing interior that run parallel to each other and protrude in the direction of the at least one opening, the ends being passed through contact openings of the printed circuit board and being connected conductively to the printed circuit board.

Abstract: The invention concerns a semiconductor component and a method for identifying a semiconductor component that comprises at least one semiconductor substrate equipped with electronic/electromechanical components, which said semiconductor substrate—except for its leads—is embedded in a housing part made of plastic. It is proposed to equip the semiconductor substrate located in the housing part with an identifier located directly or indirectly thereon that makes it possible to distinguish the semiconductor component from other similarly-designed semiconductor components, and which can be read out from outside the housing part using ultrasound.

Abstract: A packaged electronic component and a method for packaging an electronic component are proposed, in which a chip is attached to the upper side of a die pad. The die pad and the chip are enclosed by a plastic molding compound. A gel is disposed on the upper side of the chip and on the lower side of the die pad.

Abstract: A method is proposed for joining a silicon plate (1) to a second plate (2), a laser beam being directed through the silicon plate (1) at the second plate (2). In the process, the wavelength of the laser beam is selected in such a way that only a negligibly small amount of energy is absorbed in the silicon plate (1). A strongly absorbent material is hotmelted by the laser beam's energy and then produces a bond between the silicon plate (1) and the second plate (2).

Abstract: A sealed housing for an electronic device has a housing bottom part which has a first contact surface; a housing top part which has a second contact surface; the housing bottom part being connectable to the housing top part; and a seal which is insertable between the housing bottom part and the housing top part so that it contacts the first contact surface and the second contact surface to form a seal when the housing bottom part and the housing top part are joined. The seal is in the form of a continuous disk.