Abstract: A circuit carrier is disclosed that includes a base body having two flat sides and a plurality of narrow sides, a first conductor track applied to a first flat side of the base body, and a leadframe arranged in the interior of the base body. A method for producing the circuit carrier is also disclosed.

Abstract: A pressure sensor for detecting a pressure of a medium, in particular for a braking apparatus, includes a connecting flange having a fluid channel for connection to the medium which is to be measured, a pressure measuring cell which is arranged at the end of the fluid channel, and a circuit mount, with the pressure measuring cell having a contact surface for making contact. The contact surface is arranged at an angle relative to a center axis of the pressure sensor.

Abstract: A plastic molding material contains at least one filler and a polymer resin, selected from the group made up of cyanate ester resins, epoxy novolac resins, multifunctional epoxy resins, bismaleimide resins and their mixtures. The proportion of filler in the plastic molding material is in the range of 65 to 92 wt. %, with reference to the overall mass of the plastic molding material.

Abstract: A pressure sensor for detecting a pressure of a medium, in particular for a braking apparatus, includes a connecting flange having a fluid channel for connection to the medium which is to be measured, a pressure measuring cell which is arranged at the end of the fluid channel, and a circuit mount, with the pressure measuring cell having a contact surface for making contact. The contact surface is arranged at an angle relative to a center axis of the pressure sensor.

Abstract: A circuit carrier is disclosed that includes a base body having two flat sides and a plurality of narrow sides, a first conductor track applied to a first flat side of the base body, and a leadframe arranged in the interior of the base body. A method for producing the circuit carrier is also disclosed.

Abstract: A motion sensor, in particular an rpm sensor for the wheel rotation of a motor vehicle, and a method for producing a motion sensor are proposed, the motion sensor having an integrated circuit (32), connectable via an electrical cable (24), with a measured value transducer and an electronic circuit arrangement for processing the measurement signals. The sensor has a basic component (10), produced by casting or injection molding of thermoplastic, preferably polyamide, by the MID technique, into which basic component a permanent magnet (16) is integrated. A housingless integrated circuit (32) is mounted on the MID component by the flip-chip technique. The arrangement comprising the basic component (10) and the integrated circuit (32) and the permanent magnet (16) as well as the connection end of the cable (24) is sheathed, in a further method step, with an external encapsulation (42) and joined together to form a strong component unit that is well protected against environmental factors.

Abstract: A micromechanical structural element, having a very stable diaphragm, implemented in a pure front process and in a layer construction on a substrate. The layer construction includes at least one sacrificial layer and one diaphragm layer above the sacrificial layer, which is structured for laying bare the diaphragm and generating stabilizing elements on the diaphragm, at least one recess being generated for a stabilizing element of the diaphragm. The structure generated in the sacrificial layer is then at least superficially closed with at least one material layer being deposited above the structured sacrificial layer, this material layer forming at least a part of the diaphragm layer and being structured to generate at least one etch hole for etching the sacrificial layer, which is removed from the region under the etch hole, the diaphragm and the at least one stabilizing element being laid bare, a cavity being created under the diaphragm.

Abstract: In a mass flow sensor having a layered structure on the upper side of a silicon substrate (1), and having at least one heating element (8) patterned out of a conductive layer in the layered structure, thermal insulation between the heating element (8) and the silicon substrate (1) is achieved by way of a silicon dioxide block (5) which is produced beneath the heating element (8) either in the layered structure on the silicon substrate (1) or in the upper side of the silicon substrate (1). As a result, the sensor can be manufactured by surface micromechanics, i.e. without wafer back-side processes.

Abstract: A micromechanical structural element, having a very stable diaphragm, implemented in a pure front process and in a layer construction on a substrate. The layer construction includes at least one sacrificial layer and one diaphragm layer above the sacrificial layer, which is structured for laying bare the diaphragm and generating stabilizing elements on the diaphragm, at least one recess being generated for a stabilizing element of the diaphragm. The structure generated in the sacrificial layer is then at least superficially closed with at least one material layer being deposited above the structured sacrificial layer, this material layer forming at least a part of the diaphragm layer and being structured to generate at least one etch hole for etching the sacrificial layer, which is removed from the region under the etch hole, the diaphragm and the at least one stabilizing element being laid bare, a cavity being created under the diaphragm.

Abstract: In a mass flow sensor having a layered structure on the upper side of a silicon substrate (1), and having at least one heating element (8) patterned out of a conductive layer in the layered structure, thermal insulation between the heating element (8) and the silicon substrate (1) is achieved by way of a silicon dioxide block (5) which is produced beneath the heating element (8) either in the layered structure on the silicon substrate (1) or in the upper side of the silicon substrate (1). As a result, the sensor can be manufactured by surface micromechanics, i.e. without wafer back-side processes.