Abstract: A workpiece processing machine that includes: a beam emission head for providing a beam for processing the workpiece, an optical interferometer for splitting, redirecting, and detecting the beam, an adjustment element for changing a second portion of a power of the beam redirected from a retroreflector to a detector, and a control unit for actuating the adjustment element to control a ratio between a first power portion of the beam redirected from the workpiece to the detector and the second power portion of the beam redirected from the retroreflector to the detector to a target ratio.

Abstract: A workpiece processing machine that includes: a beam emission head for providing a beam for processing the workpiece, an optical interferometer for splitting, redirecting, and detecting the beam, an adjustment element for changing a second portion of a power of the beam redirected from a retroreflector to a detector, and a control unit for actuating the adjustment element to control a ratio between a first power portion of the beam redirected from the workpiece to the detector and the second power portion of the beam redirected from the retroreflector to the detector to a target ratio.

Abstract: Detection of defects during a machining process includes: moving a laser beam along a predefined path over multiple workpieces to be machined so as to generate a weld seam or a cutting gap in the workpieces; detecting, in a two-dimensional spatially resolved detector field of a detector, radiation emitted and/or reflected by the multiple workpieces; selecting at least one detection field section in the detection field of the detector based on laser beam control data defining movement of the laser beam along the predefined path or based on a previously determined actual-position data of the laser beam along the predefined path, wherein each detection field section comprises a region encompassing less than the entire detection field; evaluating the radiation detected in the selected detection field section; and determining whether a defect exists at the weld seam or the cutting gap based on the evaluated radiation.

Abstract: This disclosure relates to verifying a seam quality during a laser welding process. In certain aspects, a method includes detecting, in a spatially resolved manner, a first amount of radiation emerging from a workpiece in a first wavelength range, determining a first geometric parameter of a seam characteristic based on the first amount of radiation detected in the first wavelength range, detecting, in a spatially resolved manner, a second amount of radiation emerging from the workpiece in a second wavelength range, the second wavelength range being different than the first wavelength range, determining a second geometric parameter of the seam characteristic based on the second amount of radiation detected in the second wavelength range, comparing the first and second geometric parameters to respective reference values or to respective tolerance intervals to provide respective comparison results, and logically combining the respective comparison results to verify the seam quality.

Abstract: Detection of defects during a machining process includes: moving a laser beam along a predefined path over multiple workpieces to be machined so as to generate a weld seam or a cutting gap in the workpieces; detecting, in a two-dimensional spatially resolved detector field of a detector, radiation emitted and/or reflected by the multiple workpieces; selecting at least one detection field section in the detection field of the detector based on laser beam control data defining movement of the laser beam along the predefined path or based on a previously determined actual-position data of the laser beam along the predefined path, wherein each detection field section comprises a region encompassing less than the entire detection field; evaluating the radiation detected in in the selected detection field section; and determining whether a defect exists at the weld seam or the cutting gap based on the evaluated radiation.

Abstract: This disclosure relates to verifying a seam quality during a laser welding process. In certain aspects, a method includes detecting, in a spatially resolved manner, a first amount of radiation emerging from a workpiece in a first wavelength range, determining a first geometric parameter of a seam characteristic based on the first amount of radiation detected in the first wavelength range, detecting, in a spatially resolved manner, a second amount of radiation emerging from the workpiece in a second wavelength range, the second wavelength range being different than the first wavelength range, determining a second geometric parameter of the seam characteristic based on the second amount of radiation detected in the second wavelength range, comparing the first and second geometric parameters to respective reference values or to respective tolerance intervals to provide respective comparison results, and logically combining the respective comparison results to verify the seam quality.

Abstract: A diode laser apparatus includes a plurality of laser bars, each laser bar having an emission direction and a beam path. The laser bars are disposed along an arc, the emission directions of the laser bars are directed toward an inside of the arc, and a slow-axis direction of each laser bar is oriented along the arc.

Abstract: A diode laser apparatus includes a plurality of laser bars, each laser bar having an emission direction and a beam path. The laser bars are disposed along an arc, the emission directions of the laser bars are directed toward an inside of the arc, and a slow-axis direction of each laser bar is oriented along the arc.

Abstract: Mounting substrate and heat sink for high-power diode laser bars, the mounting substrate permitting mounting of the high-power diode laser bars by hard-soldering on the basis of a matching expansion to the semiconductor material. The mounting substrate is difficult to bend and of extremely high thermal conductivity, and can be used universally for the various cooling elements of conductive and convective cooling mechanisms.

Abstract: Mounting substrate and heat sink for high-power diode laser bars, the mounting substrate permitting mounting of the high-power diode laser bars by hard-soldering on the basis of a matching expansion to the semiconductor material. The mounting substrate is difficult to bend and of extremely high thermal conductivity, and can be used universally for the various cooling elements of conductive and convective cooling mechanisms.

Abstract: A high-power diode laser and a method for mounting same are described. Predetermined breaking locations in the laser bar are provided which, during cooling after the laser bar has been soldered to a heat sink having a smaller thermal expansion coefficient, lead to breakage at defined locations between the single laser diodes of the laser bar. As a result of the physical division of the laser bar, it is possible to use a solder which has low ductility (hard solder) at room temperature, since destruction of the single laser diodes of the laser bar as a result of mechanical stresses can be ruled out.