Patents by Inventor Friedrich Becker
Friedrich Becker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250080368Abstract: A device for operation in a network, wherein a first interface is connected to a second interface via a two-core through line, which has a first line core and a second line core; wherein a supply unit is connected to the two-core through line via a first, input-side node pair and a line branch; wherein a data and electronic unit is arranged via a node pair in the line branch leading to the supply unit and via an output-side line and a second, output-side node pair parallel to the through line; wherein at least one first push-pull choke is arranged as a low-pass filter in the line branch between the node pair and the supply unit; and wherein a second push-pull choke is arranged as a low-pass filter in the through line between the first, input-side node pair and the second, output-side node pair.Type: ApplicationFiled: August 28, 2024Publication date: March 6, 2025Applicant: Turck Holding GmbHInventor: Friedrich Becker
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Patent number: 11892892Abstract: A method detects the electrical topology of a supply network. The network includes at least one power supply unit, a control unit, at least one field bus device, and at least one measuring device. The field bus devices are supplied by the power supply unit. The measuring device is a smart connector, a field bus device, and/or an operating value sensor integrated in the power supply unit or connected thereto. A load is a field bus device and/or another device presenting a load. The method includes a) activating a load to generate an operating signal, b) receiving the operating signal and/or a time profile of the operating signal, c) detecting the operating value, d) evaluating the detection data from the operating signal, and e) applying an algorithm to determine the topology of the supply network. A control unit includes hardware and software to carry out the method.Type: GrantFiled: September 5, 2023Date of Patent: February 6, 2024Assignee: Turck Holding GmbhInventors: Dirk Mantei, Friedrich Becker
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Publication number: 20220357711Abstract: A further field device is configured to interact with a field device having a storage device storing a configuration of at least the further field device. The field device is configured to output the configuration to the further field device and/or to receive the configuration from the further field device. The further field device is furthermore configured to receive and/or to store the configuration from the field device, in order to match the configuration received from the field device to its technical design.Type: ApplicationFiled: July 3, 2020Publication date: November 10, 2022Inventors: Friedrich Becker, Hermann Schwagmann
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Patent number: 10403576Abstract: A method for manufacturing an electronic component can include the following steps: providing a semiconductor arrangement comprising a carrier structure which has at least one semiconductor chip incorporated into a potting compound, and a redistribution layer which comprises a flexible material and at least one strip conductor, wherein the carrier structure at least in regions is connected to the redistribution layer, and the at least one semiconductor chip is electrically conductively connected to the redistribution layer, and separating the carrier structure along at least one trench in a manner such that the carrier structure is divided into at least two singularized carrier elements, wherein two adjacent ones of the singularized carrier elements are connected to one another over the respective trench by way of the redistribution layer.Type: GrantFiled: October 4, 2016Date of Patent: September 3, 2019Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.Inventors: Tanja Braun, Karl-Friedrich Becker, Ruben Kahle, Michael Töpper
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Publication number: 20170098611Abstract: A method for manufacturing an electronic component can include the following steps: providing a semiconductor arrangement comprising a carrier structure which has at least one semiconductor chip incorporated into a potting compound, and a redistribution layer which comprises a flexible material and at least one strip conductor, wherein the carrier structure at least in regions is connected to the redistribution layer, and the at least one semiconductor chip is electrically conductively connected to the redistribution layer, and separating the carrier structure along at least one trench in a manner such that the carrier structure is divided into at least two singularized carrier elements, wherein two adjacent ones of the singularized carrier elements are connected to one another over the respective trench by way of the redistribution layer.Type: ApplicationFiled: October 4, 2016Publication date: April 6, 2017Inventors: Tanja Braun, Karl-Friedrich Becker, Ruben Kahle, Michael Töpper
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Patent number: 9583827Abstract: A millimeter-wave radar device including at least one millimeter-wave circuit and at least one antenna, wherein the millimeter-wave radar device is designed as a module having a multilayered multipolymer circuit board having at least a first layer composed of a polymer material having low dispersion of the dielectric constant, a second layer composed of a high-strength polymer material, which stabilizes the multipolymer circuit board, and a metallization layer, which is arranged between the first layer and the second layer and serves for shielding and for signal carrying, and the multipolymer circuit board carries the at least one millimeter-wave circuit and the at least one antenna.Type: GrantFiled: December 20, 2012Date of Patent: February 28, 2017Assignee: FRAUNHOFER-GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG E.V.Inventors: Axel Hulsmann, Harald Von Rosenberg, Karl-Friedrich Becker
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Publication number: 20150009081Abstract: A millimeter-wave radar device including at least one millimeter-wave circuit and at least one antenna, wherein the millimeter-wave radar device is designed as a module having a multilayered multipolymer circuit board having at least a first layer composed of a polymer material having low dispersion of the dielectric constant, a second layer composed of a high-strength polymer material, which stabilizes the multipolymer circuit board, and a metallization layer, which is arranged between the first layer and the second layer and serves for shielding and for signal carrying, and the multipolymer circuit board carries the at least one millimeter-wave circuit and the at least one antenna.Type: ApplicationFiled: December 20, 2012Publication date: January 8, 2015Applicant: Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.Inventors: Axel Hulsmann, Harald Von Rosenberg, Karl-Friedrich Becker
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Patent number: 8828709Abstract: The invention relates to a method with which proteins from formalin-fixed biological samples can be dissolved and subsequently quantified. The method makes it possible to extract intact full-length proteins from the samples and to conduct a subsequent analysis thereof.Type: GrantFiled: May 10, 2006Date of Patent: September 9, 2014Assignee: Qiagen GmbHInventors: Peter Porschewski, Karl-Friedrich Becker
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Publication number: 20090124510Abstract: The invention relates to a method with which proteins from formalin-fixed biological samples can be dissolved and subsequently quantified. The method makes it possible to extract intact full-length proteins from the samples and to conduct a subsequent analysis thereof.Type: ApplicationFiled: May 10, 2006Publication date: May 14, 2009Inventors: Peter Porschewski, Karl-Friedrich Becker
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Publication number: 20060286950Abstract: The invention relates to a mobile radio receiver comprising a receiving device (22, 19) for receiving time reference signals.Type: ApplicationFiled: October 20, 2003Publication date: December 21, 2006Applicant: Koninklijke Philips Electronics N.V.Inventor: Rolf Friedrich Becker
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Patent number: 7011989Abstract: A method for producing encapsulated chips includes preparing a wafer with contacts projecting from a surface of the wafer. The wafer is disposed on a dicing substrate and diced into a plurality of spaced chips on the dicing substrate. The contacts are covered with a protection arrangement, then injection molding being conducted to introduce encapsulation material into the contacts and the trenches. Then the protection arrangement is removed so that the contacts are exposed.Type: GrantFiled: October 30, 2003Date of Patent: March 14, 2006Assignee: Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung E.V.Inventors: Karl-Friedrich Becker, Tanja Braun, Mathias Koch, Andreas Ostmann, Lars Böttcher, Erik Jung
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Publication number: 20050088208Abstract: Circuit comprising a signal input (IN) for receiving an input signal s(t) and a digital input stage (15) being designed for operation at a supply voltage (VDD). The input stage (15) comprises CMOS transistors, which are sensitive to voltages across transistor nodes going beyond a voltage limit (Vmax), and an input (IINV). Voltage limiting means (B) being are arranged between the signal input (IN) and the input (IINV). The voltage limiting means (B) comprise an input switch (ns) being controllable by the state of the input signal s(t), and limit voltages at the input (IINV) to the supply voltage (VDD). In addition, means for over-voltage protection (A) are provided between the signal input (IN) and the supply voltage (VDD). The means for over-voltage protection (A) comprise at least one active circuit element being arranged so as to mimic part of a zener function.Type: ApplicationFiled: January 29, 2003Publication date: April 28, 2005Inventor: Rolf Friedrich Becker
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Publication number: 20040110323Abstract: A method for producing encapsulated chips includes preparing a wafer with contacts projecting from a surface of the wafer. The wafer is disposed on a dicing substrate and diced into a plurality of spaced chips on the dicing substrate. The contacts are covered with a protection arrangement, then injection molding being conducted to introduce encapsulation material into the contacts and the trenches. Then the protection arrangement is removed so that the contacts are exposed.Type: ApplicationFiled: October 30, 2003Publication date: June 10, 2004Inventors: Karl-Friedrich Becker, Tanja Braun, Mathias Koch, Andreas Ostmann, Lars Bottcher, Erik Jung
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Patent number: 6723320Abstract: The present invention describes monoclonal antibodies which are useful for the specific detection and therapy of diffuse gastric carcinoma. Further embodiments describe therapeutic and diagnostic means for the detection and for the therapy of diffuse gastric carcinomas as well as methods for the detection and therapy of diffuse gastric carcinomas.Type: GrantFiled: January 14, 2002Date of Patent: April 20, 2004Assignee: GSF Forschungszentrum fur Umwelt und Geshundheit GmbHInventors: Heinz Hofler, Karl-Friedrich Becker, Elizabeth Kremmer, Manfred Eulitz, Christoph Schuhmacher
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Publication number: 20030054005Abstract: The present invention describes monoclonal antibodies which are useful for the specific detection and therapy of diffuse gastric carcinoma. Further embodiments describe therapeutic and diagnostic means for the detection and for the therapy of diffuse gastric carcinomas as well as methods for the detection and therapy of diffuse gastric carcinomas.Type: ApplicationFiled: January 14, 2002Publication date: March 20, 2003Applicant: GSF Forschungszentrum fur Umwelt und Gesundheit GmbHInventors: Heinz Hofler, Karl-Friedrich Becker, Elizabeth Kremmer, Manfred Eulitz, Christoph Schuhmacher
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Patent number: 6447776Abstract: The present invention describes monoclonal antibodies which are useful for the specific detection of diffuse gastric carcinoma. Further embodiments describe therapeutic and diagnostic means for the detection and for the therapy of diffuse gastric carcinomas.Type: GrantFiled: July 23, 1997Date of Patent: September 10, 2002Assignee: GSF Forschungszentrum fur Umwelt und Gesundheit GmbHInventors: Heinz Höfler, Karl-Friedrich Becker, Elisabeth Kremmer, Manfred Eulitz, Christoph Schuhmacher