Abstract: A method of classifying objects in a system having an electrical signal receiver scans the objects to be classified and outputs for each object M scanned values, and an evaluation unit evaluates the M scanned values and classifies the objects into classes. Classification takes place by performing a learning process to learn adjoint prototypes corresponding to the classes, wherein an adjoint prototype is learned for each of the classes through minimization of a potential function. A classifying process is then performed wherein an object to be classified is assigned to one of the classes, according to a potential function, corresponding to the learned adjoint prototypes.

Abstract: Described is an electronic component with N input terminals, which admit N input signals, M output terminals, each of which is assigned to one or more input terminals, a component body in which, depending on the input signals, current paths or filaments are created which connect the N input terminals with the M output terminals, wherein, to establish a decision or displacement dynamics, an external quantity applied to the component switches the current flow through the component body between an initial distribution, in which the current densities (j.sub.i) between each input terminal and its assigned output terminal correspond to the input signal admitted at the respective input terminal, and a self-organizing distribution, in which the current flows only between the input terminal admitting the input signal with the highest value and its assigned output terminal.

Abstract: The invention describes a procedure and an arrangement for measurement of temperature and thickness of layer during a deposition or coating process. As coating or depositing processes known technologies of semi-conductor manufacturing arrangements, plasma devices, ion devices, and other dry-etching arrangements may be used. The invention can also be applied to the manufacture of optical coatings. As a consequence of interference of the thermal radiation of the substrate at the growing layer, the emissivity .epsilon. changes continuously during coating or depositing, therefore, a pyrometric measurement of temperature may not be applied. This basic problem is solved by the invention, which uses a reflectometer, which determines the reflectivity R of the wafer. According to the law of conservation of energy .epsilon.=1-R so that with said reflectometer the actual emissivity of the whole (multi-layer) system may be determined. The measurement of temperature then is effected by means of a determination equation.

Abstract: A process and apparatus for in situ measurement of the thickness of a thin ilm on a substrate using interference effects in the thin film. Thermal radiation of the substrate is utilized as a source of interfering bundles of electromagnetic radiation which intensity thereof is measured with a charge-coupled-device camera, and signal-processing electronics is utilized for determining in accordance with the Airy formula the thickness of the thin film on the substrate in the planar direction of the thin film and the index of refraction thereof. The low time constant for the measurement and evaluation enables the process for the recording of measurements be used for the control of coating or removal procedures.

Abstract: A semiconductor production control and measuring unit for a two-dimensional detection and control of concentration and pressure distribution of process particles within a process chamber, which forms part of a semiconductor production device and in the interior of which a vacuum can be generated with the aid of a vacuum pump. A light fan source produces a substantially parallel light fan within the process chamber, the light fan penetrating the area of the process chamber which is to be examined with regard to concentration distribution or pressure distribution, the wavelength of the light emitted by the light fan source being so short that the process particle have imparted thereto an excitation energy sufficient for fluorescent radiation. A camera is disposed at an angle with respect to the light fan and it covers the area to be examined. In the spectral region of the fluorescent radiation of the process particles, the camera has a quantum efficiency which detects the fluorescent radiation.