Abstract: Various teachings of the present disclosure include a method for welding an attachment piece to a semiconductor metallization using laser welding. The method may include: arranging an attachment piece having a flat side with a thin point so the flat side faces the semiconductor metallization; and welding the flat side to the semiconductor metallization. The flat side rests against a flat side of the semiconductor metallization over an entire surface area of the flat side. The thin point is formed with a cup shape of the attachment piece. The cup shape is open in the direction away from the semiconductor metallization.

Abstract: A rod-shaped measuring electrode (6, 7) for a magnetic-inductive flow meter includes an end face (15) provided at one end of the rod for contact with a measuring medium and includes a plurality of layers (17) made alternately of a ceramic coating (18) and a metal coating (19) extending in the longitudinal direction of the rod over the length thereof.

Abstract: A component is manufactured by selective laser melting by a laser having an intensity profile set largely constant by a diffractive optical element, so that the treatment surface which has occurred as a result of this profile is melted uniformly on the surface of the component. Thermal load peaks, such as occur due to an intensity maximum of an unshaped laser, can therefore be advantageously avoided. Moreover, the treatment surface may, for example, have a square shape, so that, in the case of rectangular components, it becomes simpler to produce the corners of the cross section to be manufactured. Overall, as a result, components having improved surface quality can be produced. The system is equipped with suitable optics for generating the intensity profile described.

Abstract: With respect to an electronic component, in particular a power module, and in a corresponding method for producing or contact-connecting said component, the component (1) is fastened to an electrically insulating carrier film (3) having at least one first inorganic material and at least one opening (5) in which at least one electrical contact-connection (7) of the component (1) to outside the component (1) is provided. This makes it possible to provide electronic components (1), in particular power modules, for a temperature range of >175 DEG C.

Abstract: With respect to an electronic component, in particular a power module, and in a corresponding method for producing or contact-connecting said component, the component (1) is fastened to an electrically insulating carrier film (3) having at least one first inorganic material and at least one opening (5) in which at least one electrical contact-connection (7) of the component (1) to outside the component (1) is provided. This makes it possible to provide electronic components (1), in particular power modules, for a temperature range of >175 DEG C.

Abstract: An encapsulation for SAW components and a method for producing the encapsulation use a cap to seal component structures on a substrate. The cap is in the form of a cover on the substrate and has cutouts which accommodate the component structures in regions of the component structures.

Abstract: An encapsulation for SAW components and a method for producing the encapsulation use a cap to seal component structures on a substrate. The cap is in the form of a cover on the substrate and has cutouts which accommodate the component structures in regions of the component structures.