Abstract: A sensor embedded in a high temperature metal is incorporated into a sensing system for measuring temperature, strain, or other properties of a metal structure. An optical system transmits light to and receives output signals from the sensor for analysis. With rotating structures, an optical fiber lead transmits light between the sensor and external surface of the structure along its rotational axis, allowing the lead to remain fixed with respect to the optical system as the structure rotates at high speeds.

Abstract: A method for fabricating sub-millimeter sized parts uses electrodes created from patterned silicon wafers for electric-discharge machining (EDM), in which an electric discharge is generated between a patterned electrode and a conductive workpiece. Workpiece material corresponding to the electrode pattern is removed by electroerosion, and the remaining workpiece contains the desired part. Electrodes are formed by etching stepped patterns in silicon wafers and depositing a thin metallic layer on the wafer. The resulting electrode is used in an EDM machine, and an inverse pattern is produced in the part. Alternately, the silicon wafer pattern is filled by a metal to produce a metal electrode with an inverse pattern. The wafer is removed from the metal, and the metal is used in an EDM machine. The resulting part has the same pattern as the silicon wafer used to create the metal electrode.

Abstract: The invention utilizes green support structures during sintering to maintain the shape, reduce sagging and prevent separate part sections from coming into contact and fusing together during the sintering process. In the most preferred embodiment, monolithic green structures are form with integrated support green structures that are released from the parts after sintering. Preferably monolithic green structures are formed by the Mold Shape Deposition Manufacturing (Mold SDM) process. By the method described, complex sintered structures can be made having interlocking and independently movable interlocking parts.

Abstract: Micro-Mold Shape Deposition Manufacturing (&mgr;-Mold SDM) is a method for fabricating complex, three-dimensional microstructures from layered silicon molds. Silicon wafers are etched using conventional silicon-processing techniques to produce wafers with surface patterns, some of which contain through-etched regions. The wafers are then stacked and bonded together to form a mold, which is filled with part material. In one embodiment, the part material is a ceramic or metallic gelcasting slurry that is poured into the mold and solidified to form a part precursor. The mold is removed, and the precursor is sintered to form the final part. The gelcasting material may also be a polymer or magnetic slurry, in which case sintering is not needed. The mold can also be filled by electroplating a metal into it; if necessary, each layer is filled with metal after being bonded to a previously filled layer.