Patents by Inventor Friedrich Seger

Friedrich Seger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadframe for electronic components
    Patent number: 8927342
    Abstract: The present invention specifies a leadframe for electronic components and a corresponding manufacturing process, in which the bonding islands are formed by welding individual, prefabricated segments of a bonding-capable material onto a stamped leadframe.
    Type: Grant
    Filed: October 12, 2009
    Date of Patent: January 6, 2015
    Assignee: Tyco Electronics AMP GmbH
    Inventors: Peter Goesele, Friedrich Seger, Josef Sinder, Joachim Stifter, Oliver Werner
  • LEADFRAME FOR ELECTRONIC COMPONENTS
    Publication number: 20110260304
    Abstract: The present invention specifies a leadframe for electronic components and a corresponding manufacturing process, in which the bonding islands are formed by welding individual, prefabricated segments of a bonding-capable material onto a stamped leadframe.
    Type: Application
    Filed: October 12, 2009
    Publication date: October 27, 2011
    Applicant: Tyco Electronics AMP GmbH
    Inventors: Peter Goesel, Friedrich Seger, Josef Sinder, Joachim Stifter, Oliver Werner