Abstract: Disclosed are scratch-resistant, transparent and tough copolyamide molding compounds distinguished by high scratch-resistance, excellent transparency and great toughness, which are suitable for producing transparent moulded articles or transparent coatings. The molding compounds are obtained by polycondensation of a carboxylic acid mixture including at least one aliphatic dicarboxylic acid and at least one aromatic dicarboxylic acid with at least one cycloaliphatic diamine. Also disclosed are molded parts or coatings produced from the copolyamide compounds.

Abstract: A transparent, amorphous polyamide molding compound contains polyamides which are formed by polycondensation of a linear aliphatic dicarboxylic acid with a cycloaliphatic diamine and also blends thereof, and also additives and/or colorants. The linear aliphatic dicarboxylic acid is selected from dicarboxylic acids with 17 to 21 C atoms and the diamine is bis(3-methyl-4-aminocyclohexyl)methane (MACM) and cross-linking additives, in the case of the additives, and photochromic colorants, in the case of the colorants, are precluded.

Abstract: The invention relates to a polyamide moulding compound made of a polyamide (PA MACM12) made of bis(3-methyl-4-aminocyclohexyl)methane (MACM) and dodecanedioic acid, a polyamide (PA PACM12) made of bis(4-aminocyclohexyl)methane (PACM) and dodecanedioic acid, a polyamide (PA MACM10) made of bis(3-methyl-4-aminocyclohexyl)methane and decanedioic acid, a polyamide (PA PACM10) made of bis(4-aminocyclohexyl)methane and decanedioic acid, a polyamide (PA MACM14) made of bis(3-methyl-4-aminocyclohexyl)methane and tetradecanedioic acid, a polyamide (PA PACM14) made of (bis(4-aminocyclohexyl)methane and tetradecanedioic acid and also mixtures and copolyamides thereof. Furthermore, the moulding compound comprises as impact modifier a functionalised styrene-ethylene/butylene-styrene block copolymer and also possibly further additives. Likewise, the invention relates to moulded articles produced from this polyamide moulding compound.

Abstract: Polyamide molding materials for transparent molding parts. The materials comprise transparent copolyamides that contain: (A) 40 to 100 wt % of at least one transparent copolyamide with a glass transition temperature (Tg) of at least 80° C. and not more than 150° C., composed of at least two diamines that are different from each other, wherein the at least two diamines are a mixture of (a) 50 to 90 mol % bis-(4-amino-3-methylcyclohexyl)methane (MACM) and/or bis-(4-amino-3-ethylcyclohexyl)methane (EACM) and/or bis-(4-amino-3,5-dimethylcyclohexyl)methane (TMACM) and b) 10 to 50 mol % aliphatic diamine having 9 to 14 carbon atoms, in particular decandiamine, particularly preferably at least 20 mol % decandiamine, each relative to the total amount of diamines, and of one or more aliphatic dicarboxylic acids, having 6 to 36 carbon atoms, (B) 0 to 60 wt % of at least one further polymer, (C) 0 to 10 wt % of additives, the sum of the components (A), (B) and (C) totaling 100% by weight.

Abstract: A polyamide molding composition is described comprising the following components (A)-(C) in the following composition, where the entirety of components (A), (B) and (C) gives 100% by weight: (A) from 25 to 75% by weight of at least one transparent copolyamide composed of (a) from 50 to 90 mol % of a cycloaliphatic diamine selected from the group consisting of: bis(4-amino-3-methylcyclohexyl)methane (MACM), bis(4-aminocyclohexyl)methane (PACM), bis(4-amino-3-ethylcyclohexyl)methane (EACM), bis(4-amino-3,5-dimethylcyclohexyl)methane (TMACM) and mixtures thereof and (b) from 10 to 50 mol % of an unbranched, aliphatic diamine, based in each case on the total amount of diamines, and also (c) of one or more aliphatic and cycloaliphatic dicarboxylic acid(s), (B) from 25 to 75% by weight of at least one further polyamide of PAXY type, where X and Y can assume, independently of one another, the values from 9 to 14, (C) from 0 to 10% by weight of additives.

Abstract: The invention relates to a polyamide moulding compound made of a polyamide (PA MACM12) made of bis(3-methyl-4-aminocyclohexyl)methane (MACM) and dodecanedioic acid, a polyamide (PA PACM12) made of bis(4-aminocyclohexyl)methane (PACM) and dodecanedioic acid, a polyamide (PA MACM10) made of bis(3-methyl-4-aminocyclohexyl)methane and decanedioic acid, a polyamide (PA PACM10) made of bis(4-aminocyclohexyl)methane and decanedioic acid, a polyamide (PA MACM14) made of bis(3-methyl-4-aminocyclohexyl)methane and tetradecanedioic acid, a polyamide (PA PACM14) made of (bis(4-aminocyclohexyl)methane and tetradecanedioic acid and also mixtures and copolyamides thereof. Furthermore, the moulding compound comprises as impact modifier a functionalised styrene-ethylene/butylene-styrene block copolymer and also possibly further additives. Likewise, the invention relates to moulded articles produced from this polyamide moulding compound.

Abstract: Disclosed are scratch-resistant, transparent and tough copolyamide moulding compounds distinguished by high scratch-resistance, excellent transparency and great toughness, which are suitable for producing transparent moulded articles or transparent coatings. The moulding compounds are obtained by polycondensation of a carboxylic acid mixture including at least one aliphatic dicarboxylic acid and at least one aromatic dicarboxylic acid with at least one cycloaliphatic diamine. Also disclosed are moulded parts or coatings produced from the copolyamide compounds.

Abstract: The invention relates to polyamide molding material for the production of transparent or colorable moldings with high flexibility, high notched impact strength (Charpy), low water absorption and excellent chemical resistance, comprising at least one partly crystalline, transparent copolyamide (A) with a glass transition temperature (Tg) of at most 80° C. and a melting temperature of at least 150° C., and a heat of fusion of at least 20 J/g, where the glass transition temperature (Tg), the melting temperature (Tm) and the heat of fusion (HF) are determined according to ISO 11357-1/2, under conditions where the differential scanning calorimetry (DSC) is performed with a heating rate of 20 K/min, wherein the copolyamide (A) includes no aromatic dicarboxylic acids.

Abstract: The invention relates to polyamide molding compounds with improved scratch resistance, which are constructed from (A1) 50 to 99.99 parts by weight of a copolyamide, (A2) 0 to 49.99 parts by weight of a transparent polyamide, (A3) 0 to 29.99 parts by weight of an aliphatic polyamide, (B) 0.01 to 5 parts by weight of at least one lubricant, and (C) 0 to 3 parts by weight of further additives, with the proviso that the sum of (A1) and (A2) and (A3) and (B) produces 100 parts by weight.

Abstract: The invention is directed to a transparent mold made of a polyamide molding material containing at least one polyamide formed from at least one diamine selected from the group of hexamethylene diamine (HMDA), bis-(4-amino-3-methylcyclohexyl)methane (MACM) and/or bis-(4-amino-cyclohexyl)methane (PACM) as well as from at least one dicarboxylic acid selected from the group of isophthalic acid (IPS), terephthalic acid (TPS) and/or dodecanedioic acid (DDS) or from the aforementioned diamines and dicarboxylic acids in combination with lactams and/or ?-/?-amino acids.

Abstract: A polyamide moulding composition is described, based on a mixture made of transparent copolyamides and of semicrystalline, aliphatic polyamides for producing transparent mouldings, an example being, in particular, a material for the casing of devices such as mobile phones etc.

Abstract: The invention relates to the use of a UV absorber in the production of transparent polyamide products or polyamide molded parts. The use according to the invention is characterized in that at least one UV absorber having at least one substituted benzoyl group is added to a polyamide molding compound, by which means melts of polyamide molding compounds comprising these UV absorbers leave no visible blooming on surfaces with which they come into contact during the production or processing of polyamide products. Particularly preferred polyamide molding compounds produced according to the use according to the invention comprise PA 6I/MXDI, PA MACM12, PA MACMI/MACMT/12 or PA 6I/6T/MACMI/MACMT/PACMI/PACMT/12 as well as one or more UV absorbers in the form of a dibenzoylmethane compound and/or an aminohydroxybenzoyl benzoic acid ester.

Abstract: The invention relates to a polyamide molding material or copolyamide molding material and the use of such a polyamide molding material or copolyamide molding material for producing steam-sterilizable transparent moldings and extrudates. This polyamide molding material is characterized in that it comprises at least one copolyamide formed from 35-42 mol % of bis(4-amino-3-methylcyclohexyl)methane (MACM), 35-42 mol % of isophthalic acid (IPS) and 16-30 mol % of laurolactam (LC12). MACM may be replaced up to 50% by bis(4-aminocyclohexyl)-methane (PACM) and IPA up to 50% by terephthalic acid (TPA). The polyamide molding material may also be a blend of copolyamides or a blend of copolyamides with polyamide 12. The relative viscosity (RV) of the polyamide molding material or copolyamide molding material is in any case adjusted to a value which is greater than 1.45.

Abstract: The invention relates to polyamide moulded masses based on semi-crystalline, transparent copolyamides predominantly based on aliphatic monomers, for producing transparent or pigmentable moulded parts with a high level of flexibility, high notch-impact strength (Charpy), low water absorbency and excellent resistance to chemicals, containing between 40 and 100 wt. % of at least one transparent copolyamide (constituent A) with a maximum glass transition temperature (Tg) of 80° C. and a melting temperature of at least 150° C.

Abstract: The invention discloses novel polyamide moulding materials which are characterized by a significantly improved processability, in particular in injection-moulding, an acceptable deformation in climatic testing, a very high transparency, low haze and even an increased biobased content. The polyamide moulding materials on the basis of transparent copolyamides for producing transparent moulding parts having a high tenacity, low water absorption and low distorsion in climatic testing contain: (A) 40 to 100 percent by weight of at least one transparent copolyamide with a glass transition temperature (Tg) of at least 80 ° C. and not more than 150 ° C.

Abstract: A transparent, amorphous polyamide moulding compound contains polyamides which are formed by polycondensation of a linear aliphatic dicarboxylic acid with a cycloaliphatic diamine and also blends thereof, and also additives and/or colourants. The linear aliphatic dicarboxylic acid is selected from dicarboxylic acids with 17 to 21 C atoms and the diamine is bis(3-methyl-4-aminocyclohexyl)methane (MACM) and cross-linking additives, in the case of the additives, and photochromic colourants, in the case of the colourants, are precluded.

Abstract: The invention relates to a polyamide molding material or copolyamide molding material and the use of such a polyamide molding material or copolyamide molding material for producing steam-sterilizable transparent moldings and extrudates. This polyamide molding material is characterized in that it comprises at least one copolyamide formed from 35-42 mol % of bis(4-amino-3-methylcyclohexyl)methane (MACM), 35-42 mol % of isophthalic acid (IPS) and 16-30 mol % of laurolactam (LC12). MACM may be replaced up to 50% by bis(4-aminocyclohexyl)-methane (PACM) and IPA up to 50% by terephthalic acid (TPA). The polyamide molding material may also be a blend of copolyamides or a blend of copolyamides with polyamide 12. The relative viscosity (RV) of the polyamide molding material or copolyamide molding material is in any case adjusted to a value which is greater than 1.45.

Abstract: The invention relates to polyamide moulding compounds with improved scratch resistance, which are constructed from (A1) 50 to 99.99 parts by weight of a copolyamide, (A2) 0 to 49.99 parts by weight of a transparent polyamide, (A3) 0 to 29.99 parts by weight of an aliphatic polyamide, (B) 0.01 to 5 parts by weight of at least one lubricant, and (C) 0 to 3 parts by weight of further additives, with the proviso that the sum of (A1) and (A2) and (A3) and (B) produces 100 parts by weight.

Abstract: The invention relates to a polyamide molding compound melt comprising a UV absorber for the production of transparent plastic products or molded parts, which have a reduced transmission for light up to a wavelength of 400 nm. The polyamide molding compound melt according to the invention is characterized in that it comprises at least one UV absorber, of which at least one UV absorber is a compound having at least one substituted benzoyl group, wherein the polyamide molding compound melt comprising this at least one UV absorber causes no visible blooming on surfaces with which it comes into contact during processing. Particularly preferred polyamide molding compound melts comprise PA 6I/MXDI, PA MACM12, PA MACMI/MACMT/12 or PA 6I/6T/MACMI/MACMT/PACMI/PACMT/12 as well as one or more UV absorbers in the form of a dibenzoylmethane compound and/or an aminohydroxybenzoyl benzoic acid ester.

Abstract: The invention is directed to a transparent mold made of a polyamide molding material containing at least one polyamide formed from at least one diamine selected from the group of hexamethylene diamine (HMDA), bis-(4-amino-3-methylcyclohexyl)methane (MACM) and/or bis-(4-amino-cyclohexyl)methane (PACM) as well as from at least one dicarboxylic acid selected from the group of isophthalic acid (IPS), terephthalic acid (TPS) and/or dodecanedioic acid (DDS) or from the aforementioned diamines and dicarboxylic acids in combination with lactams and/or ?-/?-amino acids.