Patents by Inventor FSPG Hi-Tech Co., Ltd.

FSPG Hi-Tech Co., Ltd. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130177747
    Abstract: A thermoplastic resin film laminate is prepared by thermal compressing including: at least a thermoplastic resin film layer with a thickness of 1-250 ?m, at least a thermoplastic resin product layer, and a bonding layer of glue in between the thermoplastic resin film layer and the thermoplastic resin product layer, wherein the thermoplastic resin product layer is a thermoplastic resin film or a thermoplastic resin fabric, and the thermoplastic resin fabric can be a woven fabric and/or a nonwoven. In the laminate, the fabric has a gram per square meter weight of 1-250 g/m2 and the bonding layer has gram per square meter weight of more than 0.1 g/m2. The laminate has good breathability and high moisture transmission rate. The laminate is smooth with no wrinkles and has a soft handfeel.
    Type: Application
    Filed: January 7, 2013
    Publication date: July 11, 2013
    Applicants: PGI NONWOVENS (CHINA) CO., LTD., FSPG HI-TECH CO., LTD.
    Inventors: FSPG Hi-Tech Co., Ltd., PGI Nonwovens (China) Co., Ltd.