Patents by Inventor Fu-Chen CHU

Fu-Chen CHU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device package
    Patent number: 11328999
    Abstract: A semiconductor device package includes a lower-density substrate and a higher-density substrate. The higher-density substrate is attached to the lower-density substrate. The higher-density substrate has a first interconnection layer and a second interconnection layer disposed over the first interconnection layer. A thickness of the first interconnection layer is different from a thickness of the second interconnection layer.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: May 10, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Fu-Chen Chu, Hung-Chun Kuo, Chen-Chao Wang
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20210175175
    Abstract: A semiconductor device package includes a lower-density substrate and a higher-density substrate. The higher-density substrate is attached to the lower-density substrate. The higher-density substrate has a first interconnection layer and a second interconnection layer disposed over the first interconnection layer. A thickness of the first interconnection layer is different from a thickness of the second interconnection layer.
    Type: Application
    Filed: December 6, 2019
    Publication date: June 10, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Fu-Chen CHU, Hung-Chun KUO, Chen-Chao WANG
  • Semiconductor package device and method of manufacturing the same
    Patent number: 10332849
    Abstract: A semiconductor package device includes: (1) a substrate having a first surface; (2) a permeable element including a first portion disposed on the first surface of the substrate, a second portion protruding from the first portion, and a third portion disposed on the second portion and contacting the second portion of the permeable element; (3) a first electrical element disposed on the substrate and surrounded by the second portion of the permeable element; and (4) a coil disposed on the substrate and surrounding the second portion of the permeable element.
    Type: Grant
    Filed: September 4, 2018
    Date of Patent: June 25, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chang-Lin Yeh, Jen-Chieh Kao, Chih-Yi Huang, Fu-Chen Chu
  • SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20180374805
    Abstract: A semiconductor package device includes: (1) a substrate having a first surface; (2) a permeable element including a first portion disposed on the first surface of the substrate, a second portion protruding from the first portion, and a third portion disposed on the second portion and contacting the second portion of the permeable element; (3) a first electrical element disposed on the substrate and surrounded by the second portion of the permeable element; and (4) a coil disposed on the substrate and surrounding the second portion of the permeable element.
    Type: Application
    Filed: September 4, 2018
    Publication date: December 27, 2018
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chang-Lin YEH, Jen-Chieh KAO, Chih-Yi HUANG, Fu-Chen CHU
  • Semiconductor package device and method of manufacturing the same
    Patent number: 10074622
    Abstract: A semiconductor package device includes a substrate, a first package body, a permeable element and a coil. The substrate includes a first surface. The first package body encapsulates the first surface of the substrate. The permeable element includes a first portion disposed on the first surface of the substrate and a second portion disposed on the package body. The coil is within the first package body.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: September 11, 2018
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chang-Lin Yeh, Jen-Chieh Kao, Chih-Yi Huang, Fu-Chen Chu
  • SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20180226365
    Abstract: A semiconductor package device includes a substrate, a first package body, a permeable element and a coil. The substrate includes a first surface. The first package body encapsulates the first surface of the substrate. The permeable element includes a first portion disposed on the first surface of the substrate and a second portion disposed on the package body. The coil is within the first package body.
    Type: Application
    Filed: February 6, 2017
    Publication date: August 9, 2018
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chang-Lin YEH, Jen-Chieh KAO, Chih-Yi HUANG, Fu-Chen CHU