Patents by Inventor FU-CHENG HUNG

FU-CHENG HUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240308085
    Abstract: A robot gripper for moving wafer carriers and packing materials and a method of operating the same are provided. The gripper mechanism has two clamp assemblies, each with a support pin at the bottom. The clamps are configured to move towards or away from each other, and the support pins are configured to move relative to the clamp assemblies. The first clamp assembly has a main clamp and a secondary clamp with a protrusion, while the second clamp assembly has a similar configuration.
    Type: Application
    Filed: May 22, 2024
    Publication date: September 19, 2024
    Inventors: CHIEN-FA LEE, FENG-KUANG WU, FU-CHENG HUNG, CHI-WEI CHEN, CHIH-HUA CHEN
  • Patent number: 12017342
    Abstract: A robot gripper for moving wafer carriers and packing materials and a method of operating the same are provided. The gripper mechanism has two clamp assemblies, each with a support pin at the bottom. The clamps are configured to move towards or away from each other, and the support pins are configured to move relative to the clamp assemblies. The first clamp assembly has a main clamp and a secondary clamp with a protrusion, while the second clamp assembly has a similar configuration.
    Type: Grant
    Filed: May 12, 2023
    Date of Patent: June 25, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chien-Fa Lee, Feng-Kuang Wu, Fu-Cheng Hung, Chi-Wei Chen, Chih-Hua Chen
  • Publication number: 20230278231
    Abstract: A robot gripper for moving wafer carriers and packing materials and a method of operating the same are provided. The gripper mechanism has two clamp assemblies, each with a support pin at the bottom. The clamps are configured to move towards or away from each other, and the support pins are configured to move relative to the clamp assemblies. The first clamp assembly has a main clamp and a secondary clamp with a protrusion, while the second clamp assembly has a similar configuration.
    Type: Application
    Filed: May 12, 2023
    Publication date: September 7, 2023
    Inventors: CHIEN-FA LEE, FENG-KUANG WU, FU-CHENG HUNG, CHI-WEI CHEN, CHIH-HUA CHEN
  • Patent number: 11685055
    Abstract: A robot gripper for moving wafer carriers and packing materials and a method of operating the same are provided. The robot gripper includes two opposing clamp assemblies. The two clamp assemblies are configured to move close to or away from each other. Each of the clamp assemblies includes a movable support pin at a bottom of the clamp assembly.
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: June 27, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chien-Fa Lee, Feng-Kuang Wu, Fu-Cheng Hung, Chi-Wei Chen, Chih-Hua Chen
  • Publication number: 20210331327
    Abstract: A robot gripper for moving wafer carriers and packing materials and a method of operating the same are provided. The robot gripper includes two opposing clamp assemblies. The two clamp assemblies are configured to move close to or away from each other. Each of the clamp assemblies includes a movable support pin at a bottom of the clamp assembly.
    Type: Application
    Filed: August 25, 2020
    Publication date: October 28, 2021
    Inventors: CHIEN-FA LEE, FENG-KUANG WU, FU-CHENG HUNG, CHI-WEI CHEN, CHIH-HUA CHEN