Abstract: The present invention provides a superconducting and isothermal heat-dissipation module meeting the heat-dissipation demand for different heating elements. The superconducting and isothermal heat-dissipation module of the present invention includes a heat-conducting isothermal plate and a frame made according to the contour of the heating element. The heat-conducting isothermal plate has an upper and a lower covers, and plural pillar partition pieces served as support bodies, which are uprightly provided between the upper and the lower covers and is closely contacted with the inner faces of the upper and a lower covers. A cavity for filling a heat transfer medium is formed by sealing the upper, lower covers and the pillar partition pieces. The frame is provided with one or several insertion hole(s) for the insertion of said heat-conducting isothermal plate therein for mutual integration.