Patents by Inventor Fu-Chih Chen

Fu-Chih Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240186446
    Abstract: A semiconductor structure comprises a substrate, an adhesion layer, arranged on the substrate, a first release layer, arranged on the adhesion layer and a first semiconductor device, comprising a semiconductor epitaxial stack, and a conducting layer directly connected to the first release layer, wherein the first semiconductor device is not electrically connected to the substrate by the adhesion layer and the first release layer.
    Type: Application
    Filed: February 13, 2024
    Publication date: June 6, 2024
    Inventors: Hao-Min KU, You-Hsien CHANG, Shih-I CHEN, Fu-Chun TSAI, Hsin-Chih CHIU
  • Patent number: D404674
    Type: Grant
    Filed: February 19, 1998
    Date of Patent: January 26, 1999
    Assignee: Fu-Chang Chen
    Inventor: Fu-Chih Chen
  • Patent number: D419099
    Type: Grant
    Filed: August 21, 1998
    Date of Patent: January 18, 2000
    Assignee: Fu-Chang Chen
    Inventor: Fu-Chih Chen