Abstract: A heat sink device mounted on a circuit board including an electronic component includes a heat sink to dissipate heat generated by the electronic component and a shielding member electrically connecting the circuit board and the heat sink to prevent the electronic component from electromagnetic interference (EMI). The heat sink includes a base, a plurality of heat fins extending upwardly from the base, and a plurality of receiving grooves defined in the base. The plurality of receiving grooves are arranged in rows around the plurality of heat fins. The shielding member includes a plurality of contact plates abutting against the circuit board and a plurality of receiving plates received in the plurality of receiving grooves.

Abstract: A heat sink device mounted on a circuit board including an electronic component includes a heat sink to dissipate heat generated by the electronic component and a shielding member electrically connecting the circuit board and the heat sink to prevent the electronic component from electromagnetic interference (EMI). The heat sink includes a base, a plurality of heat fins extending upwardly from the base, and a plurality of receiving grooves defined in the base. The plurality of receiving grooves are arranged in rows around the plurality of heat fins. The shielding member includes a plurality of contact plates abutting against the circuit board and a plurality of receiving plates received in the plurality of receiving grooves.

Abstract: In the present invention, a system for interlocking material supply equipment in semiconductor manufacture management system comprises collecting means for collecting a user's identification and content identification of material supply equipment. Communication means is for transferring the user's identification and the content identification. A controller is communicated with the material supply equipment and the collecting means through the communication means. Alarm means is coupled to the material supply equipment and communicated with the controller. A method for interlocking managing change materials of material supply equipment comprises collecting a changed material information in an material supply equipment. The changed material information is checked by a controller communicated with the material supply equipment. An alarm message is transferred to the material supply equipment from the controller. The corresponding material supply equipment is disabled according to said alarm message.

Abstract: In the present invention, a system for interlocking material supply equipment in semiconductor manufacture management system comprises collecting means for collecting a user's identification and content identification of material supply equipment. Communication means is for transferring the user's identification and the content identification. A controller is communicated with the material supply equipment and the collecting means through the communication means. Alarm means is coupled to the material supply equipment and communicated with the controller. A method for interlocking managing change materials of material supply equipment comprises collecting a changed material information in an material supply equipment. The changed material information is checked by a controller communicated with the material supply equipment. An alarm message is transferred to the material supply equipment from the controller. The corresponding material supply equipment is disabled according to said alarm message.