Patents by Inventor Fu Chuen TAN

Fu Chuen TAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CMOS COMPATIBLE WAFER BONDING LAYER AND PROCESS
    Publication number: 20150048509
    Abstract: A wafer bonding layer and a process for using the same for bonding wafers are presented. The wafer bonding process includes providing a first wafer, providing a second type wafer and providing a water bonding layer. The wafer bonding layer is provided separately on a contact surface layer of the first or second wafer as part of a CMOS compatible processing recipe.
    Type: Application
    Filed: August 14, 2014
    Publication date: February 19, 2015
    Inventors: Ranganathan NAGARAJAN, Fu Chuen TAN, Kia Hwee Samuel LOW, Chun Hoe YIK, Jiaqi WU, Jingze TIAN, Pradeep Ramachandramurthy YELEHANKA, Rakesh KUMAR