Patents by Inventor Fu-Chun Chen

Fu-Chun Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thin-film forming method
    Patent number: 6468921
    Abstract: A thin-film forming method applied in an IC manufacturing process is disclosed. The thin-film forming method is used for forming a thin film on a topographically rugged substrate with an improved evenness. The method is characterized in that after a depositing step for forming the thin film is finished, the thin film is continuously ion bombed for a specific time to improve the evenness of the thin film.
    Type: Grant
    Filed: September 26, 2001
    Date of Patent: October 22, 2002
    Assignee: Winbond Electronics Corp.
    Inventors: Hon-Ling Shih, Chung-Chieh Juan, Fu-Chun Chen, An-Chow Chen