Patents by Inventor Fu-Feng Liu

Fu-Feng Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11971797
    Abstract: A digital mirroring method includes creating a digital model for each physical device of a plurality of physical devices located in a physical space. Once a related data of each physical device is obtained, the related data of each physical device is mapped to corresponding digital model.
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: April 30, 2024
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Xin Lu, Fu-Fa Cai, Hui-Feng Liu
  • Publication number: 20240071803
    Abstract: Methods and systems for dry etching are disclosed. The system includes a wafer clamp ring having a central opening through which a substrate may be treated and a plurality of smaller, outer support holes for receiving pins from plunger assemblies. The outer support holes are tapered and change in diameter. The tapered shape reduces horizontal shifting of the wafer clamp ring which can occur as the wafer clamp ring is moved up-and-down during operational use. The reduced shifting increases wafer yield along the edges of the wafer.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Inventors: Fu-Yi Liu, Chou-Feng Lee, Chih-Hsien Hsu
  • Patent number: D525942
    Type: Grant
    Filed: June 17, 2005
    Date of Patent: August 1, 2006
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Jie Cheng, Jian-Tao Lin, Wei-Ya Cheng, Fu-Feng Liu