Abstract: A cutting method of a semiconductor package module and a semiconductor package unit are provided. The cutting method of the semiconductor package module includes steps as follow. A plurality of semiconductor chips are disposed on a substrate, and the semiconductor chips and a surface of the substrate are covered with a packaging layer. A plurality of cutting lines are defined on the surface of the substrate. A plurality of spot-like depressions are formed on the substrate or the packaging layer along the cutting lines by laser. A force is applied to the substrate such that the substrate is broken along the cutting lines and a plurality of semiconductor package units are formed.