Patents by Inventor Fu-Hau Tsai

Fu-Hau Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat-dissipating assembly and securing device used therein
    Patent number: 6822864
    Abstract: The invention provides a heat-dissipating assembly and a securing device used therein, which utilizes a way of securing by applying force in one direction to prevent the surface of a chip from being damaged. The securing device includes a frame body having a plurality of first fasteners fastened to a socket by the first fasteners; and a wrenching member pivotally coupled to the frame body, wherein after applying an external force on the wrenching member in one direction, the heat-dissipating device can be fixed tightly on the socket.
    Type: Grant
    Filed: December 4, 2002
    Date of Patent: November 23, 2004
    Assignee: Delta Electronics, Inc.
    Inventors: Wen-shi Huang, Kuo-cheng Lin, Fu-hau Tsai, Yu-hung Huang
  • Composite heat-dissipating device
    Patent number: 6779992
    Abstract: A composite heat-dissipating device is provided for significantly increasing the number and size of blades so as to enhance the heat-dissipating performance. The composite heat-dissipating device is constructed by a plurality of impellers, each of which includes a plurality of blades. When the plurality of impellers are assembled together, the plurality of blades are arranged around the hub of the composite heat-dissipating device and there is an overlapped region formed between every two adjacent blades.
    Type: Grant
    Filed: June 18, 2002
    Date of Patent: August 24, 2004
    Assignee: Delta Electronics Inc.
    Inventors: Tsung-Yu Lei, Fu-Hau Tsai, Kuo-Cheng Lin, Wen-Shi Huang
  • Composite heat-dissipating device
    Publication number: 20030185682
    Abstract: A composite heat-dissipating device is provided for significantly increasing the number and size of blades so as to enhance the heat-dissipating performance. The composite heat-dissipating device is constructed by a plurality of impellers, each of which includes a plurality of blades. When the plurality of impellers are assembled together, the plurality of blades are arranged around the hub of the composite heat-dissipating device and there is an overlapped region formed between every two adjacent blades.
    Type: Application
    Filed: June 18, 2002
    Publication date: October 2, 2003
    Inventors: Tsung-Yu Lei, Fu-Hau Tsai, Kuo-Cheng Lin, Wen-Shi Huang
  • Heat-dissipating assembly and securing device used therein
    Publication number: 20030142478
    Abstract: The invention provides a heat-dissipating assembly and a securing device used therein, which utilizes a way of securing by applying force in one direction to prevent the surface of a chip from being damaged. The securing device includes a frame body having a plurality of first fasteners fastened to a socket by the first fasteners; and a wrenching member pivotally coupled to the frame body, wherein after applying an external force on the wrenching member in one direction, the heat-dissipating device can be fixed tightly on the socket.
    Type: Application
    Filed: December 4, 2002
    Publication date: July 31, 2003
    Inventors: Wen-shi Huang, Kuo-cheng Lin, Fu-hau Tsai, Yu-hung Huang
  • Fan blade
    Patent number: D485904
    Type: Grant
    Filed: September 24, 2002
    Date of Patent: January 27, 2004
    Assignee: Delta Electronics Inc.
    Inventors: Fu-Hau Tsai, Kuo-Cheng Lin, Wen-Shi Huang
  • Frame of cooler
    Patent number: D492654
    Type: Grant
    Filed: July 5, 2002
    Date of Patent: July 6, 2004
    Assignee: Delta Electronics Inc.
    Inventors: Tsung-Yu Lei, Fu-Hau Tsai, Kuo-Cheng Lin, Wen-Shi Huang
  • Frame for a cooling fan
    Patent number: D494548
    Type: Grant
    Filed: July 1, 2002
    Date of Patent: August 17, 2004
    Assignee: Delta Electronics, Inc.
    Inventors: Fu-Hau Tsai, Tsung-Yu Lei, Kuo-Cheng Lin, Wen-Shi Huang