Abstract: A source/drain region is disposed in a substrate. A gate structure is disposed over the substrate. A gate spacer is disposed on a sidewall of the gate structure. The gate spacer and the gate structure have substantially similar heights. A via is disposed over and electrically coupled to: the source/drain region or the gate structure. A mask layer is disposed over the gate spacer. The mask layer has a greater dielectric constant than the gate spacer. A first side of the mask layer is disposed adjacent to the via. A dielectric layer is disposed on a second side of the mask layer, wherein the mask layer is disposed between the dielectric layer and the via.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes an insulating layer over a substrate, a gate stack formed in the insulating layer, and an insulating capping layer formed in the insulating layer to cover the gate stack. The semiconductor device structure also includes a source/drain contact structure adjacent to the gate stack. The source/drain contact structure has a sidewall that is in direct contact with a sidewall of the insulating capping layer, and an upper surface that is substantially level with an upper surface of the insulating capping layer and an upper surface of the insulating layer. In addition, the semiconductor device structure includes a first via structure above and electrically connected to the gate stack and a second via structure above and electrically connected to the source/drain contact structure.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a conductive gate stack formed over a substrate. A gate dielectric layer covers opposite sidewalls and a bottom of the conductive gate stack. A first gate spacer layer and a second gate spacer layer respectively cover portions of the gate dielectric layer corresponding to the opposite sidewalls of the conductive gate stack. A source/drain contact structure is separated from the conductive gate stack by the gate dielectric layer and the first gate spacer layer. A first insulating capping feature covers the conductive gate stack and is separated from the second gate spacer layer by the gate dielectric layer, and a second insulating capping feature covers the source/drain contact structure. An upper surface of the second insulating capping feature is substantially level with an upper surface of the first insulating capping feature.

Abstract: A semiconductor device includes a substrate, a first gate structure and a second gate structure over the substrate, a first hard mask on a top surface of the first gate structure, a second hard mask on the second gate structure and a third hard mask disposed between the first gate structure and the second gate structure and disposed between the first hard mask and the second hard mask. A bottom surface of the third hard mask is substantially flush with a bottom surface of the first gate structure.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a gate stack formed over a semiconductor substrate, a source/drain contact structure adjacent to the gate stack, and a gate spacer formed between the gate stack and the source/drain contact structure. The semiconductor device structure also includes a first insulating capping feature covering an upper surface of the gate stack, a second insulating capping feature covering an upper surface of the source/drain contact structure, and an insulating layer covering the upper surfaces of the first insulating capping feature and the second insulating capping feature. The second insulating capping feature includes a material that is different from a material of the first insulating capping feature. The semiconductor device structure also includes a via structure passing through the insulating layer and the first insulating capping feature and electrically connected to the gate stack.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a gate electrode layer formed over a substrate, and a gate spacer adjacent to the gate electrode layer. The semiconductor device structure includes a source/drain contact structure formed over the substrate and adjacent to the gate electrode layer. An air gap is formed between the gate spacer and the source/drain contact structure, and the air gap is in direct contact with the gate spacer.

Abstract: Field effect transistor and manufacturing method thereof are disclosed. Field effect transistor includes a substrate, a fin, spacers, a gate structure, a hard mask pattern, an insulating layer, and a gate contact. The fin protrudes from the substrate and extends in a first direction. The spacers run in parallel over the fin and extending in a second direction perpendicular to the first direction. The gate structure extends between the spacers and covers the fin. The hard mask pattern covers the gate structure and extends in between the spacers. The insulating layer is disposed over the substrate and covers the hard mask pattern, the gate structure and the spacers. The gate contact penetrates the insulating layer and physically contacts the gate structure. A bottom surface of the gate contact is coplanar with top surfaces of the spacers and the hard mask pattern.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a gate stack formed over a semiconductor substrate, a source/drain contact structure laterally adjacent to the gate stack, and a gate spacer formed between the gate stack and the source/drain contact structure. The semiconductor device structure also includes a first insulating capping feature covering the upper surface of the gate stack, a second insulating capping feature covering the upper surface of the source/drain contact structure, and an insulating layer covering the upper surfaces of the first insulating capping feature and the second insulating capping feature. The second insulating capping feature includes a material that is different from the material of the first insulating capping feature. The semiconductor device structure also includes a via structure passing through the insulating layer and the first insulating capping feature and electrically connected to the gate stack.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes an insulating layer over a substrate, a gate stack formed in the insulating layer, and an insulating capping layer formed in the insulating layer to cover the gate stack. The semiconductor device structure also includes a source/drain contact structure adjacent to the gate stack. The source/drain contact structure has a sidewall that is in direct contact with a sidewall of the insulating capping layer, and an upper surface that is substantially level with an upper surface of the insulating capping layer and an upper surface of the insulating layer. In addition, the semiconductor device structure includes a first via structure above and electrically connected to the gate stack and a second via structure above and electrically connected to the source/drain contact structure.

Abstract: A semiconductor device includes a substrate, a first gate structure and a second gate structure over the substrate, a first hard mask on a top surface of the first gate structure, a second hard mask on the second gate structure and a third hard mask disposed between the first gate structure and the second gate structure and disposed between the first hard mask and the second hard mask. A bottom surface of the third hard mask is substantially flush with a bottom surface of the first gate structure.

Abstract: Field effect transistor and manufacturing method thereof are disclosed. Field effect transistor includes a substrate, a fin, spacers, a gate structure, a hard mask pattern, an insulating layer, and a gate contact. The fin protrudes from the substrate and extends in a first direction. The spacers run in parallel over the fin and extending in a second direction perpendicular to the first direction. The gate structure extends between the spacers and covers the fin. The hard mask pattern covers the gate structure and extends in between the spacers. The insulating layer is disposed over the substrate and covers the hard mask pattern, the gate structure and the spacers. The gate contact penetrates the insulating layer and physically contacts the gate structure. A bottom surface of the gate contact is coplanar with top surfaces of the spacers and the hard mask pattern.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a gate stack over a substrate and an insulating capping layer over the gate stack. The semiconductor device structure also includes a source/drain contact structure adjacent to the gate stack and having an upper surface that is substantially level with the upper surface of the insulating capping layer. The semiconductor device structure also includes a first via structure passing through the insulating capping layer and electrically connected to the gate stack, and a second via structure above and electrically connected to the source/drain contact structure. The first via structure and the second via structure have different vertical heights.

Abstract: Semiconductor devices are provided, and includes a substrate, a first gate structure and a second gate structure over the substrate, a first hard mask on the first gate structure and a second hard mask on the second gate structure and a third hard mask. The third hard mask is disposed in a dielectric layer between the first gate structure and the second gate structure and disposed between the first hard mask and the second hard mask.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a gate stack formed over a semiconductor substrate, a source/drain contact structure adjacent to the gate stack, and a gate spacer formed between the gate stack and the source/drain contact structure. The semiconductor device structure also includes a first insulating capping feature covering an upper surface of the gate stack, a second insulating capping feature covering an upper surface of the source/drain contact structure, and an insulating layer covering the upper surfaces of the first insulating capping feature and the second insulating capping feature. The second insulating capping feature includes a material that is different from a material of the first insulating capping feature. The semiconductor device structure also includes a via structure passing through the insulating layer and the first insulating capping feature and electrically connected to the gate stack.

Abstract: A source/drain region is disposed in a substrate. A gate structure is disposed over the substrate. A gate spacer is disposed on a sidewall of the gate structure. The gate spacer and the gate structure have substantially similar heights. A via is disposed over and electrically coupled to: the source/drain region or the gate structure. A mask layer is disposed over the gate spacer. The mask layer has a greater dielectric constant than the gate spacer. A first side of the mask layer is disposed adjacent to the via. A dielectric layer is disposed on a second side of the mask layer, wherein the mask layer is disposed between the dielectric layer and the via.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a gate stack formed over a semiconductor substrate, a source/drain contact structure laterally adjacent to the gate stack, and a gate spacer formed between the gate stack and the source/drain contact structure. The semiconductor device structure also includes a first insulating capping feature covering the upper surface of the gate stack, a second insulating capping feature covering the upper surface of the source/drain contact structure, and an insulating layer covering the upper surfaces of the first insulating capping feature and the second insulating capping feature. The second insulating capping feature includes a material that is different from the material of the first insulating capping feature. The semiconductor device structure also includes a via structure passing through the insulating layer and the first insulating capping feature and electrically connected to the gate stack.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a gate stack over a substrate and an insulating capping layer over the gate stack. The semiconductor device structure also includes a source/drain contact structure adjacent to the gate stack and having an upper surface that is substantially level with the upper surface of the insulating capping layer. The semiconductor device structure also includes a first via structure passing through the insulating capping layer and electrically connected to the gate stack, and a second via structure above and electrically connected to the source/drain contact structure. The first via structure and the second via structure have different vertical heights.

Abstract: Semiconductor devices are provided, and includes a substrate, a first gate structure and a second gate structure over the substrate, a first hard mask on the first gate structure and a second hard mask on the second gate structure and a third hard mask. The third hard mask is disposed in a dielectric layer between the first gate structure and the second gate structure and disposed between the first hard mask and the second hard mask.

Abstract: The invention discloses a nanocrystal-based optoelectronic device and method of fabricating the same, such as light-emitting diode, photodetector, solar cell, etc. The optoelectronic device according to the invention includes a substrate of a first conductive type, N active layers formed on the substrate and a transparent conductive layer formed on the most-top active layer. Each active layer is constituted by a plurality of nanocrystals. Each nanocrystal is wrapped by a passivation layer.