Patents by Inventor Fu-Hsiang Yao

Fu-Hsiang Yao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ALUMINUM CIRCUIT BOARD AND METHOD AND ELECTROPLATING SOLUTION FOR MAKING THE SAME
    Publication number: 20100319968
    Abstract: An aluminum circuit board includes a body unit and a conductive wiring unit. The body unit includes an aluminum substrate, an alumina layer formed on the aluminum substrate, and a medium deposit formed on the alumina layer and made of nickel, copper, cobalt, iron, silver, zinc, tin, molybdenum, or combinations thereof. The conductive wiring unit is formed on the body unit and is bonded to the medium deposit.
    Type: Application
    Filed: February 5, 2010
    Publication date: December 23, 2010
    Inventors: Fu-Hsiang Yao, Shih-Yao Huang
  • Method For Anodizing An Aluminum Material
    Publication number: 20100000869
    Abstract: A method includes anodizing an aluminum material in an aqueous electrolytic solution containing water and an electrolyte. The electrolyte includes malonic acid and an initiator that contains ammonium ions and anions which are reactable with the ammonium ions to form an ammonium salt. The initiator is formed by dissolving an ammonium salt in the water. The ammonium salt is selected from the group consisting of ammonium acetate, ammonium nitrate, ammonium sulfate, ammonium chlorate, ammonium phosphate, and combinations thereof.
    Type: Application
    Filed: December 4, 2008
    Publication date: January 7, 2010
    Applicant: MAW-CHENG ENTERPRISE CO., LTD.
    Inventors: Allen Bai, Fu-Hsiang Yao