Abstract: A monitor vehicle for a rail system includes a wheeled trolley, an overhead vehicle, a supporting structure, and a first sensor. The wheeled trolley is above a rail of the rail system, is operable to move over the rail, and has a bottom surface. The overhead vehicle body is suspended by the wheeled trolley and below the rail. The supporting structure connects the wheeled trolley and the overhead vehicle body. The first sensor is on the bottom surface of the wheeled trolley and is configured to detect a first parameter of the rail of the rail system.

Abstract: A system for a semiconductor fabrication facility includes a manufacturing tool including a load port, a maintenance tool including a first track and at least one maintenance crane on the first track, a rectangular zone overlapping with the load port, a plurality of first sensors on the first track and at corners of the rectangular zone configured to detect a location of the maintenance crane and generate a first location date, a transporting tool including a second track and a OHT vehicle on the second track, at least a second sensor on the OHT vehicle and configured to generate a second location data, at least a third sensor on the load port, and a control unit configured to receive the first location data and the second location data, and send signals to the second sensor and the third sensor or to cut off the signal to the second sensor.

Abstract: An automatic cleaning unit for AMHS includes a plurality of sensors disposed on OHT rails. The sensors are configured to define a cleaning zone and to detect a location of an OHT vehicle. The automatic cleaning unit further includes a vacuum generator and a top cleaning part installed over the OHT rails in the cleaning zone. The top cleaning part is coupled to the vacuum generator. The vacuum generator is turned on to perform a vacuum cleaning operation when the sensors detect the OHT vehicle entering the cleaning zone.

Abstract: A monitor vehicle for a rail system includes a wheeled trolley, an overhead vehicle, a supporting structure, and a first sensor. The wheeled trolley is above a rail of the rail system, is operable to move over the rail, and has a bottom surface. The overhead vehicle body is suspended by the wheeled trolley and below the rail. The supporting structure connects the wheeled trolley and the overhead vehicle body. The first sensor is on the bottom surface of the wheeled trolley and is configured to detect a first parameter of the rail of the rail system.

Abstract: A transport system of a semiconductor fabrication facility, including: a rail for carrying vehicle, a sensor installed on the rail, a controller and a power panel. The sensor is arranged to determine a zone and send a quantity information in response to a quantity of vehicles in the zone. The controller is arranged to send an output signal in accordance with the quantity information. The power panel is arranged to adjust a current in accordance with the output signal, wherein the current is output to a cable extending along the rail.

Abstract: An apparatus for a semiconductor fabrication facility (FAB) is provided. In one embodiment, the apparatus includes a maintenance tool and a transporting tool configured to transport at least one customized. The maintenance tool includes a first track at a first horizontal plane, at least one maintenance crane movably mounted on the first track, and a plurality of first sensors on the first track. The first sensors are configured to define at least a danger zone and to detect a location of the maintenance crane. The transporting tool includes a second track at a second horizontal plane, at least one overhead hoisting transporting (OHT) vehicle movably mounted on the second track, and at least one second sensor on the OHT vehicle. The second horizontal plane is different from the first horizontal planes. The first horizontal plane and the second horizontal plane at least partially overlap each other from a plane view.

Abstract: A monitor vehicle for a rail system includes a wheeled trolley, an overhead vehicle body, at least one supporting structure, and at least one first sensor. The wheeled trolley is operable to move over one or more rails of the rail system. The supporting structure connects the wheeled trolley and overhead vehicle body. The first sensor is on the wheeled trolley and configured to detect at least one first parameter of the one or more rails of the rail system.

Abstract: A stocker for storing a plurality of wafer carriers is provided. The stocker includes a frame, a plurality of pod stoppers, a plurality of truss members and a plurality of partitions. The frame includes a plurality of stocking units. Each of the stocking units includes a carrying plate for carrying one of the plurality of wafer carriers. The pod stoppers stand on an edge of each of the carrying plates. The truss members are disposed diagonally across at least one side surface of at least one of the stocking units, wherein each of the truss members comprises a shock absorber. The partitions are disposed on side surfaces of the stocking units and fixed to the frame.

Abstract: A method includes receiving a carrier with a plurality of wafers inside; supplying a purge gas to an inlet of the carrier; extracting an exhaust gas from an outlet of the carrier; and generating a health indicator of the carrier while performing the supplying of the purge gas and the extracting of the exhaust gas.

Abstract: An apparatus for a semiconductor fabrication facility (FAB) is provided. In one embodiment, the apparatus includes a maintenance tool and a transporting tool configured to transport at least one customized. The maintenance tool includes a first track at a first horizontal plane, at least one maintenance crane movably mounted on the first track, and a plurality of first sensors on the first track. The first sensors are configured to define at least a danger zone and to detect a location of the maintenance crane. The transporting tool includes a second track at a second horizontal plane, at least one overhead hoisting transporting (OHT) vehicle movably mounted on the second track, and at least one second sensor on the OHT vehicle. The second horizontal plane is different from the first horizontal planes. The first horizontal plane and the second horizontal plane at least partially overlap each other from a plane view.

Abstract: An overhead transport (OHT) system with multiple levels of rails for the transport of semiconductor workpieces is provided. A first vehicle is configured to travel on, and move a semiconductor workpiece along, a first rail. A second vehicle is configured to travel on, and move the semiconductor workpiece along, a second rail overlying the first rail. A controller is configured to control the first and second vehicles to transfer the semiconductor workpiece along the first and second rails, between process or inspection tools. A method for transferring semiconductor workpieces across multiple levels of rails is also provided.

Abstract: A monitor vehicle for a rail system includes a wheeled trolley, an overhead vehicle body, at least one supporting structure, and at least one first sensor. The wheeled trolley is operable to move over one or more rails of the rail system. The supporting structure connects the wheeled trolley and overhead vehicle body. The first sensor is on the wheeled trolley and configured to detect at least one first parameter of the one or more rails of the rail system.

Abstract: An automated method of unpacking a container containing semiconductor wafers from a sealed bag is provided. The method includes inflating the bag with a gas using an automated gas dispenser. After inflating the bag, the bag is cut using an automated cutting device to expose the container, and the cut bag is removed from around the container.

Abstract: An overhead transport (OHT) system with multiple levels of rails for the transport of semiconductor workpieces is provided. A first vehicle is configured to travel on, and move a semiconductor workpiece along, a first rail. A second vehicle is configured to travel on, and move the semiconductor workpiece along, a second rail overlying the first rail. A controller is configured to control the first and second vehicles to transfer the semiconductor workpiece along the first and second rails, between process or inspection tools. A method for transferring semiconductor workpieces across multiple levels of rails is also provided.