Patents by Inventor Fu-Hsing Hsich

Fu-Hsing Hsich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Enhanced thermoelectric cooler with superconductive heat-dissipative device for use in air-conditioners
    Publication number: 20110132001
    Abstract: This is an enhanced thermoelectric cooler with superconductive heat-dissipative coolers for use in air-conditioner. This invention is comprised of a thermoelectric cooling chip sandwiched between two superconductive unidirectional heat-dissipative cooling devices. Each device consists of special superconductive pipes, heat-dissipative plates, and a fan. The cooling devices are to dissipate heat quickly from the thermoelectric cooling chip and to maintain constant hot to cold air flow.
    Type: Application
    Filed: February 11, 2011
    Publication date: June 9, 2011
    Inventors: I-Ming Lin, Fu-Hsing Hsich