Patents by Inventor Fu-Hsing Hsieh

Fu-Hsing Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Enhanced thermoelectric cooler with superconductive heat-dissipative device for use in air-conditioners
    Patent number: 8286436
    Abstract: This is an enhanced thermoelectric cooler with superconductive heat-dissipative coolers for use in air-conditioner. This invention is comprised of a thermoelectric cooling chip sandwiched between two superconductive unidirectional heat-dissipative cooling devices. Each device consists of special superconductive pipes, heat-dissipative plates, and a fan. The cooling devices are to dissipate heat quickly from the thermoelectric cooling chip and to maintain constant hot to cold air flow.
    Type: Grant
    Filed: February 11, 2011
    Date of Patent: October 16, 2012
    Inventors: I-Ming Lin, Fu-Hsing Hsieh
  • Enhanced thermoelectric cooler with superconductive coolers for use in air-conditioners
    Patent number: 7918092
    Abstract: This is an enhanced thermoelectric cooler with superconductive heat-dissipative coolers for use in air-conditioner. This invention is comprised of a thermoelectric cooling chip sandwiched between two superconductive unidirectional heat-dissipative cooling devices. Each device consists of special superconductive pipes, heat-dissipative plates, and a fan. The cooling devices are to dissipate heat quickly from the thermoelectric cooling chip and to maintain constant hot to cold air flow.
    Type: Grant
    Filed: March 19, 2007
    Date of Patent: April 5, 2011
    Inventors: I-Ming Lin, Fu-Hsing Hsieh
  • Enhanced thermoelectric cooler with superconductive coolers for use in air-condioners
    Publication number: 20080229758
    Abstract: This is an enhanced thermoelectric cooler with superconductive heat-dissipatve coolers for use in air-conditioner. This invention is comprised of a thermoelectric cooling chip sandwiched between two superconductive unidirectional heat-dissipative cooling devices. Each device consists of special superconductive pipes, heat-dissipative plates, and a fan. The cooling devices are to dissipate heat quickly from the thermoelectric cooling chip and to maintain constant hot to cold air flow.
    Type: Application
    Filed: March 19, 2007
    Publication date: September 25, 2008
    Inventors: I-Ming Lin, Fu-Hsing Hsieh
  • Kind of superconductive heat cooler package of vacuum used in computer CPU (Central Processing Unit)
    Publication number: 20070268668
    Abstract: This is a type of superconductive vacuum heat cooler package used in computer CPU (Central Processing Unit). This invention dissipates heat through invented metal pipe materials and formula in single direction to achieve effective cooling result. This invention is to be utilized but not limited to computer Central Processing Unit.
    Type: Application
    Filed: May 19, 2006
    Publication date: November 22, 2007
    Inventors: I-Ming Lin, Fu-Hsing Hsieh