Patents by Inventor Fu-Hua YU

Fu-Hua YU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGES WITH MULTIPLE EXPOSED PADS
    Publication number: 20230395472
    Abstract: In an example, an apparatus comprises a lead frame that includes a first row of leads, a first pad coupled to th first row of leads, and a second row of leads parallel to the first row of leads. The lead frame also includes a second pad coupled to the second row of leads. The first and second pads are separated by a gap, and each of the first and second pads has a substantially uniform thickness. The apparatus also includes a device coupled to the first and second pads. The first and second pads are exposed to an exterior of the apparatus.
    Type: Application
    Filed: August 22, 2023
    Publication date: December 7, 2023
    Inventors: Hung-Yu CHOU, Bo-Hsun PAN, Yuh-Harng CHIEN, Fu-Hua YU, Steven Alfred KUMMERL, Jie CHEN, Rajen M. MURUGAN
  • Exposed heat-generating devices
    Patent number: 11742265
    Abstract: In some examples, a semiconductor package comprises a lead frame. The lead frame includes a first row of leads; a first pad coupled to the first row of leads; a second row of leads; and a second pad coupled to the second row of leads, the first and second pads separated by a gap. The semiconductor package includes a heat-generating device coupled to the first and second pads and exposed to an exterior of the semiconductor package.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: August 29, 2023
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Hung-Yu Chou, Chi-Chen Chien, Yuh-Harng Chien, Steven Alfred Kummerl, Bo-Hsun Pan, Fu-Hua Yu
  • Packages with multiple exposed pads
    Patent number: 11735506
    Abstract: In an example, an apparatus comprises a lead frame that includes a first row of leads, a first pad coupled to the first row of leads, and a second row of leads parallel to the first row of leads. The lead frame also includes a second pad coupled to the second row of leads. The first and second pads are separated by a gap, and each of the first and second pads has a substantially uniform thickness. The apparatus also includes a device coupled to the first and second pads. The first and second pads are exposed to an exterior of the apparatus.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: August 22, 2023
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Hung-Yu Chou, Bo-Hsun Pan, Yuh-Harng Chien, Fu-Hua Yu, Steven Alfred Kummerl, Jie Chen, Rajen M. Murugan
  • EXPOSED HEAT-GENERATING DEVICES
    Publication number: 20210118779
    Abstract: In some examples, a semiconductor package comprises a lead frame. The lead frame includes a first row of leads; a first pad coupled to the first row of leads; a second row of leads; and a second pad coupled to the second row of leads, the first and second pads separated by a gap. The semiconductor package includes a heat-generating device coupled to the first and second pads and exposed to an exterior of the semiconductor package.
    Type: Application
    Filed: October 22, 2019
    Publication date: April 22, 2021
    Inventors: Hung-Yu CHOU, Chi-Chen CHIEN, Yuh-Harng CHIEN, Steven Alfred KUMMERL, Bo-Hsun PAN, Fu-Hua YU
  • PACKAGES WITH MULTIPLE EXPOSED PADS
    Publication number: 20190355652
    Abstract: In an example, an apparatus comprises a lead frame that includes a first row of leads, a first pad coupled to the first row of leads, and a second row of leads parallel to the first row of leads. The lead frame also includes a second pad coupled to the second row of leads. The first and second pads are separated by a gap, and each of the first and second pads has a substantially uniform thickness. The apparatus also includes a device coupled to the first and second pads. The first and second pads are exposed to an exterior of the apparatus.
    Type: Application
    Filed: November 30, 2018
    Publication date: November 21, 2019
    Inventors: Hung-Yu CHOU, Bo-Hsun PAN, Yuh-Harng CHIEN, Fu-Hua YU, Steven Alfred KUMMERL, Jie CHEN, Rajen M. MURUGAN