Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: A heat dissipation structure and an electronic apparatus having the heat dissipation structure are provided. The electronic apparatus includes a printed circuit board, a high thermal-resisting housing, a thermal pad and a metal bracket. Heat is transferred between the thermal pad and an electronic component mounted on the printed circuit board. The high thermal-resisting housing defines an inner space for accommodating the printed circuit board. A columnar space is formed in the high thermal-resisting housing, and a metal layer is arranged outside the columnar space. The thermal conductivity of the high thermal-resisting housing is not greater than 1 W/m·K. The metal bracket and the printed circuit board are disposed at two opposite sides of the high thermal-resisting housing, respectively. A fastening member penetrates through the metal bracket and is inserted into the columnar space to urge the metal bracket to be in contact with the metal layer.

Abstract: A heat dissipation structure and an electronic apparatus having the heat dissipation structure are provided. The electronic apparatus includes a printed circuit board, a high thermal-resisting housing, a thermal pad and a metal bracket. Heat is transferred between the thermal pad and an electronic component mounted on the printed circuit board. The high thermal-resisting housing defines an inner space for accommodating the printed circuit board. A columnar space is formed in the high thermal-resisting housing, and a metal layer is arranged outside the columnar space. The thermal conductivity of the high thermal-resisting housing is not greater than 1 W/m·K. The metal bracket and the printed circuit board are disposed at two opposite sides of the high thermal-resisting housing, respectively. A fastening member penetrates through the metal bracket and is inserted into the columnar space to urge the metal bracket to be in contact with the metal layer.