Patents by Inventor FU-JE CHEN

FU-JE CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing method of copper foil and circuit board assembly for high frequency signal transmission
    Patent number: 11466379
    Abstract: A manufacturing method of copper foil and circuit board assembly for high frequency transmission are provided. Firstly, a raw copper foil having a predetermined surface is produced by an electrolyzing process. Subsequently, a roughened layer including a plurality of copper particles is formed on the predetermined surface by an arsenic-free electrolytic roughening treatment and an arsenic-free electrolytic surface protection treatment. Thereafter, a surface treatment layer is formed on the roughened layer, and the roughened layer is made of a material which includes at least one kind of non-copper metal elements and the concentration of the non-copper metal elements is smaller than 400 ppm. By controlling the concentration of the non-copper elements, the resistance of the copper foil can be reduced.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: October 11, 2022
    Assignee: NAN YA PLASTICS CORPORATION
    Inventors: Shih-Ching Lin, Fu-Je Chen, Kuo-Chao Chen
  • MANUFACTURING METHOD OF CIRCUIT BOARD ASSEMBLY FOR HIGH FREQUENCY SIGNAL TRANSMISSION
    Publication number: 20210259113
    Abstract: A manufacturing method of copper foil and circuit board assembly for high frequency transmission are provided. Firstly, a raw copper foil having a predetermined surface is produced by an electrolyzing process. Subsequently, a roughened layer including a plurality of copper particles is formed on the predetermined surface by an arsenic-free electrolytic roughening treatment and an arsenic-free electrolytic surface protection treatment. Thereafter, a surface treatment layer is formed on the roughened layer, and the roughened layer is made of a material which includes at least one kind of non-copper metal elements and the concentration of the non-copper metal elements is smaller than 400 ppm. By controlling the concentration of the non-copper elements, the resistance of the copper foil can be reduced.
    Type: Application
    Filed: April 16, 2021
    Publication date: August 19, 2021
    Inventors: SHIH-CHING LIN, FU-JE CHEN, KUO-CHAO CHEN
  • MANUFACTURING METHOD OF COPPER FOIL AND CIRCUIT BOARD ASSEMBLY FOR HIGH FREQUENCY SIGNAL TRANSMISSION
    Publication number: 20190182964
    Abstract: A manufacturing method of copper foil and circuit board assembly for high frequency transmission are provided. Firstly, a raw copper foil having a predetermined surface is produced by an electrolyzing process. Subsequently, a roughened layer including a plurality of copper particles is formed on the predetermined surface by an arsenic-free electrolytic roughening treatment and an arsenic-free electrolytic surface protection treatment. Thereafter, a surface treatment layer is formed on the roughened layer, and the roughened layer is made of a material which includes at least one kind of non-copper metal elements and the concentration of the non-copper metal elements is smaller than 400 ppm. By controlling the concentration of the non-copper elements, the resistance of the copper foil can be reduced.
    Type: Application
    Filed: December 6, 2018
    Publication date: June 13, 2019
    Inventors: SHIH-CHING LIN, FU-JE CHEN, KUO-CHAO CHEN