Patents by Inventor Fu-Jen Yeh

Fu-Jen Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9811458
    Abstract: A mobile electronic device including an interface unit, a semiconductor storage device and a processor is provided. The interface unit provides a user interface to receive a user input. The semiconductor storage device includes a controller and a non-volatile memory. The non-volatile memory is coupled to the controller and includes a plurality of memory blocks. The processor is coupled to the interface unit and the semiconductor storage device. The processor sends a signal to the semiconductor storage device in response to the user input. The controller clears at least one of the memory blocks in response to the signal.
    Type: Grant
    Filed: March 19, 2014
    Date of Patent: November 7, 2017
    Assignee: HTC Corporation
    Inventors: Fu-Jen Yeh, Yi-Hsin Liao, Chia-Yin Lu, Shih-Hung Chu
  • Patent number: 9245633
    Abstract: A storage device, an electronic device, and a corresponding method for programming a memory are provided. The memory includes a plurality of cells. Each of the cells stores a plurality of bits. The bits of the memory are arranged into a plurality of pages of the memory. The method includes the following steps: receiving a host command for programming data into a first page of the memory; and performing 2Plane programming to program the data into the first page and backups the data into a second page of the memory when the first page does not consist of the most significant bits (MSBs) of the cells. The first page and the second page are located in different planes of the memory.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: January 26, 2016
    Assignee: HTC Corporation
    Inventors: Yi-Hsin Liao, Fu-Jen Yeh, Chia-Yin Lu, Shih-Hung Chu
  • Publication number: 20150269070
    Abstract: A mobile electronic device including an interface unit, a semiconductor storage device and a processor is provided. The interface unit provides a user interface to receive a user input. The semiconductor storage device includes a controller and a non-volatile memory. The non-volatile memory is coupled to the controller and includes a plurality of memory blocks. The processor is coupled to the interface unit and the semiconductor storage device. The processor sends a signal to the semiconductor storage device in response to the user input. The controller clears at least one of the memory blocks in response to the signal.
    Type: Application
    Filed: March 19, 2014
    Publication date: September 24, 2015
    Applicant: HTC Corporation
    Inventors: Fu-Jen Yeh, Yi-Hsin Liao, Chia-Yin Lu, Shih-Hung Chu
  • Publication number: 20150206589
    Abstract: A storage device, an electronic device, and a corresponding method for programming a memory are provided. The memory includes a plurality of cells. Each of the cells stores a plurality of bits. The bits of the memory are arranged into a plurality of pages of the memory. The method includes the following steps: receiving a host command for programming data into a first page of the memory; and performing 2Plane programming to program the data into the first page and backups the data into a second page of the memory when the first page does not consist of the most significant bits (MSBs) of the cells. The first page and the second page are located in different planes of the memory.
    Type: Application
    Filed: July 24, 2014
    Publication date: July 23, 2015
    Inventors: Yi-Hsin Liao, Fu-Jen Yeh, Chia-Yin Lu, Shih-Hung Chu
  • Patent number: 8738083
    Abstract: Disclosed herein is related to an operating method, and a memory module with wireless communication component. An exemplary example of the invention describes the memory module providing a control unit which coupled to both a wireless communication component such as an NFC chip, and anon-volatile memory unit. The memory module exemplarily uses an eMMC bus to interconnect a cellular phone system and the control unit. It is advantaged that when any data required to be transmitted between the NFC chip and the cellular phone system, a partition is specified to the chip according a partition table for further access task.
    Type: Grant
    Filed: May 7, 2012
    Date of Patent: May 27, 2014
    Assignee: Skymedi Corporation
    Inventors: Fu-Jen Yeh, Ching-Yuan Lee
  • Publication number: 20130295996
    Abstract: Disclosed herein is related to an operating method, and a memory module with wireless communication component. An exemplary example of the invention describes the memory module providing a control unit which coupled to both a wireless communication component such as an NFC chip, and anon-volatile memory unit. The memory module exemplarily uses an eMMC bus to interconnect a cellular phone system and the control unit. It is advantaged that when any data required to be transmitted between the NFC chip and the cellular phone system, a partition is specified to the chip according a partition table for further access task.
    Type: Application
    Filed: May 7, 2012
    Publication date: November 7, 2013
    Applicant: SKYMEDI CORPORATION
    Inventors: FU-JEN YEH, CHING-YUAN LEE
  • Publication number: 20100275730
    Abstract: A method is disclosed for recycling precious metal from used printed circuit boards. The used printed circuit boards are roasted with plasma at 800 degrees Celsius for less than 10 minutes, thus producing exhaust and residue that contains the precious metal. The exhaust is treated with an exhaust-treatment system before it is released to the atmosphere. The residue is ground and turned into scraps of a diameter smaller than 2 mm. The scraps are subjected to magnetic separation, thus separating ferromagnetic scraps from non-ferromagnetic scraps. The ferromagnetic scraps are refined. The non-ferromagnetic scraps are screened, thus separating tiny non-ferromagnetic scraps from big non-ferromagnetic scraps. The tiny non-ferromagnetic scraps contain silver and gold. The big non-ferromagnetic scraps contain copper.
    Type: Application
    Filed: January 7, 2008
    Publication date: November 4, 2010
    Applicant: ATOMIC ENERGY COUNCIL - INSTITUTE OF NUCLEAR ENERGY RESEARCH
    Inventors: Wen-Cheng Lee, Ching-Hwa Lee, Ching-Liang Chen, Fu-Jen Yeh, Hei-Yi Chen, Yun-Hua Chen