Patents by Inventor FU-JU ZENG

FU-JU ZENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11029260
    Abstract: A solder paste printing quality inspection (SPI) method includes establishing at least one data inspection model, acquiring real-time test data, preprocessing the real-time test data, and determining a type of the real-time test data and inputting the real-time test data into the data inspection model corresponding to the type of the real-time test data to obtain a judgment result of the solder paste printing quality inspection. The real-time test data includes one or both of a test image and a test value of solder paste printing quality inspection. The preprocessing includes obtaining key parameters of the test value or obtaining image data of the test image and standardizing the real-time test data.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: June 8, 2021
    Assignees: HONGFUJIN PRECISION ELECTRONICS (CHENGDU) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Zi-Qing Xia, Xiao-Lei Liu, Min Chen, Yi-Kun Wang, Fu-Ju Zeng
  • Publication number: 20200292471
    Abstract: A solder paste printing quality inspection (SPI) method includes establishing at least one data inspection model, acquiring real-time test data, preprocessing the real-time test data, and determining a type of the real-time test data and inputting the real-time test data into the data inspection model corresponding to the type of the real-time test data to obtain a judgment result of the solder paste printing quality inspection. The real-time test data includes one or both of a test image and a test value of solder paste printing quality inspection. The preprocessing includes obtaining key parameters of the test value or obtaining image data of the test image and standardizing the real-time test data.
    Type: Application
    Filed: April 30, 2019
    Publication date: September 17, 2020
    Inventors: ZI-QING XIA, XIAO-LEI LIU, MIN CHEN, YI-KUN WANG, FU-JU ZENG