Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A signal input device includes a casing, an input body and a support component. The casing includes at least one air-intake hole. An accommodating space is formed inside the casing. The support component supports the input body. A chamber is formed inside the support component and includes a first through hole and a second through hole. The first through hole is in fluid communication with the outside.

Abstract: A signal input device includes a casing, an input body and a support component. The casing includes at least one air-intake hole. An accommodating space is formed inside the casing. The support component supports the input body. A chamber is formed inside the support component and includes a first through hole and a second through hole. The first through hole is in fluid communication with the outside.

Abstract: The disclosure relates to a heat conductive plate and a heat dissipating module using the same. The heat dissipating module is adapted for dissipating the heat generated by a heat source. The heat dissipating module includes a heat pipe and the heat conductive plate. The carrier unit has a first surface and a second surface opposite to each other. The first surface thermally contacts with the heat pipe. The second surface thermally contacts with the heat source. The extending unit is disposed on the first surface of the carrier unit. The extending unit includes a first extending section. The first extending section extends away from the first surface of the carrier unit.

Abstract: A heat dissipation base seat includes a main body. A first extension arm, a second extension arm, a third extension arm and a fourth extension arm respectively extend from four corners of the main body. Two first bent sections respectively extend from two sides of the first extension arm. Two second bent sections respectively extend from two sides of the second extension arm. Two third bent sections respectively extend from two sides of the third extension arm. Two fourth bent sections respectively extend from two sides of the fourth extension arm. At least one locating hole is formed at a free end of each of the first, second, third and fourth extension arms, which free end is distal from the main body. By means of the first, second, third and fourth bent sections, the structural strengths of the extension arms are greatly increased.

Abstract: A heat-dissipation base structure includes a main board and at least one mounting member. The main board has four chamfered corners to form four pressing ends and is provided on an upper face with at least one retaining section. The mounting member is provided with at least one locating section for engaging with the at least one retaining section, and includes at least one outward extended arm portion. The arm portion is formed along a bottom with a downward protruded portion, so an opening is formed on the arm portion at a proximal end of the downward protruded portion for engaging with one pressing end of the main board when the mounting member and the arm portion are mounted to the upper face of the main board. Therefore, the heat-dissipation base structure has increased structural strength and the arm portion is less possibly deformed due to bending stress therein.

Abstract: A heat-dissipating base includes a main body. The main body has a basic portion. Four corners of the basic portion are respectively connected to a first extending arm, a second extending arm, a third extending arm and a fourth extending arm. Both sides of the first, second, third, and fourth extending arms are respectively provided with a first bending portion, a second bending portion, a third bending portion and a fourth bending portion. An end of the first, second, third, and fourth extending arms opposite to the basic portion is respectively formed with at least one positioning hole. The first, second, third and fourth bending portions are configured to increase the structural strength of the first, second, third and fourth extending arms respectively.

Abstract: A flow guide structure includes a support body including a hollow frame body. At least one first flow way and at least one flow guide assembly are disposed in the hollow frame body. The flow guide assembly has multiple flow guide plates arranged at intervals. At least one second flow way is formed between the flow guide plates. When a cooling fan creates airflow and blows the airflow to a heat sink and a circuit board, the flow guide plates of the flow guide assembly can also guide the airflow to those areas with high heat so as to lower the temperature of the electronic components in the areas.