Abstract: Aspects of the invention relate to a keyboard key structure, a light guide for the keyboard key structure, and a computer key mechanism. The keyboard key structure can include a substrate; a key switch where the bottom of the key switch is configured to be coupled to the substrate; a keycap including a transparent region; a light guide coupled to the side of the key switch, the light guide comprising: a bottom surface and a top surface that is wider than and parallel to the bottom surface; a light emitting element coupled to the substrate and configured under the bottom surface of the light guide such that the light emitting element, the light guide, and the transparent region of the key cap are in a collinear arrangement.

Abstract: A system may comprise a printed circuit board (PCB) including a top surface, and a bracket including a top surface configured to receive and couple to a key switch and a bottom surface including at least two protrusions that extend normal to the bottom surface of the bracket. The bracket can be configured to mount to the PCB such that the bottom surface of the bracket is coupled to the top surface of the PCB, and the at least two protrusions may each include conductive leads that couple to the top surface of the PCB. The bracket is configured to only cover a portion of a bottom surface of the key switch when coupled to the key switch. An LED can be mounted to the top surface of the PCB, laterally adjacent to the bracket, and under the key switch at a location not covered by the bracket.

Abstract: A system may comprise a printed circuit board (PCB) including a top surface, and a bracket including a top surface configured to receive and couple to a key switch and a bottom surface including at least two protrusions that extend normal to the bottom surface of the bracket. The bracket can be configured to mount to the PCB such that the bottom surface of the bracket is coupled to the top surface of the PCB, and the at least two protrusions may each include conductive leads that couple to the top surface of the PCB. The bracket is configured to only cover a portion of a bottom surface of the key switch when coupled to the key switch. An LED can be mounted to the top surface of the PCB, laterally adjacent to the bracket, and under the key switch at a location not covered by the bracket.

Abstract: Aspects of the invention relate to a keyboard key structure, a light guide for the keyboard key structure, and a computer key mechanism. The keyboard key structure can include a substrate; a key switch where the bottom of the key switch is configured to be coupled to the substrate; a keycap including a transparent region; a light guide coupled to the side of the key switch, the light guide comprising: a bottom surface and a top surface that is wider than and parallel to the bottom surface; a light emitting element coupled to the substrate and configured under the bottom surface of the light guide such that the light emitting element, the light guide, and the transparent region of the key cap are in a collinear arrangement.

Abstract: Aspects of the invention relate to a keyboard key structure, a light guide for the keyboard key structure, and a computer key mechanism. The keyboard key structure can include a substrate; a key switch where the bottom of the key switch is configured to be coupled to the substrate; a keycap including a transparent region; a light guide coupled to the side of the key switch, the light guide comprising: a planar bottom surface and a planar top surface that is wider than and parallel to the bottom surface; a light emitting element coupled to the substrate and configured under the bottom surface of the light guide such that the light emitting element, the light guide, and the transparent region of the key cap are in a collinear arrangement.

Abstract: A system may comprise a printed circuit board (PCB) including a top surface, and a bracket including a top surface configured to receive and couple to a key switch and a bottom surface including at least two protrusions that extend normal to the bottom surface of the bracket. The bracket can be configured to mount to the PCB such that the bottom surface of the bracket is coupled to the top surface of the PCB, and the at least two protrusions may each include conductive leads that couple to the top surface of the PCB. The bracket is configured to only cover a portion of a bottom surface of the key switch when coupled to the key switch. An LED can be mounted to the top surface of the PCB, laterally adjacent to the bracket, and under the key switch at a location not covered by the bracket.

Abstract: A manufacturing method for an isothermal evaporation casting process is disclosed and to design the manufacturing method for the simple atmospheric casting. The present invention can melt the Mg—Ni alloy with the aspect of totally different melting points thereof, and the other elements can be added during melting simultaneously. Through the Mg—Ni alloy with a suitable weight ratio, the eutectic alloy of Mg/Mg2Ni and high purified ?-phase Mg2Ni can be made. Then adding other elements are to produce the composition of Mg/Ni/M. By way of the manufacturing method of the present invention, the melting equipment is simplified; and, through different manufacturing steps, the purposes of time-saving and low cost are reached; further that, a large amount of the eutectic alloy of Mg/Mg2Ni with different kinds of ratios of Mg, high purified ?-phase Mg2Ni, or the composition of Mg/Ni/M can be obtained.

Abstract: This invention discloses a method and an apparatus of preventing a gas leak in a pipeline, and the characteristic of expansion occurred when a hydrogen storage material absorbs hydrogen gas is used for setting the hydrogen storage material in a joint between a first pipeline and a second pipeline, such that if hydrogen leaks at the joint, the hydrogen storage material will absorb hydrogen to expand, and the expansion pressure presses the joint to give a tighter connection, so as to achieve the effects of preventing and locking a leak, and compensating a deficiency of tightness due to an accumulated error occurred during the manufacture of the first pipeline and the second pipeline.

Abstract: A manufacturing method for an isothermal evaporation casting process is disclosed and to design the manufacturing method for the simple atmospheric casting. The present invention can melt the Mg—Ni alloy with the aspect of totally different melting points thereof, and the other elements can be added during melting simultaneously. Through the Mg—Ni alloy with a suitable weight ratio, the eutectic alloy of Mg/Mg2Ni and high purified ?-phase Mg2Ni can be made. Then adding other elements are to produce the composition of Mg/Ni/M. By way of the manufacturing method of the present invention, the melting equipment is simplified; and, through different manufacturing steps, the purposes of time-saving and low cost are reached; further that, a large amount of the eutectic alloy of Mg/Mg2Ni with different kinds of ratios of Mg, high purified ?-phase Mg2Ni, or the composition of Mg/Ni/M can be obtained.