Patents by Inventor Fu-Kun Yeh

Fu-Kun Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7801947
    Abstract: A software deployment system and method are provided. The system includes a server and at least one client. The server executes a first server application and a second server application simultaneously. The client controls at least one equipment tool, executes a first client application connected to the first server application, and has a second client application. In response to a deployment signal, the client first deletes the first client application and executes the second client application to connect to the second server application if all equipment tools controlled by the client are idle. The client then transmits a completion signal to the server. If software deployment on each client is complete, the server deletes the first server application.
    Type: Grant
    Filed: December 28, 2004
    Date of Patent: September 21, 2010
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Fu-Kun Yeh, Ting-Yuan Huang
  • Patent number: 7751908
    Abstract: A thermal process system. The thermal process system comprises a thermal processor, a metrology tool, and a controller. The thermal processor performs a thermal process as defined by a heating model to form a film on a wafer surface. The metrology tool, interfaced with the thermal processor, inspects thickness of the film. The controller, coupled with the thermal processor and the metrology tool, generates the heating model of the thermal processor and calibrates the heating model according to a preset slope coefficient matrix and the measured thickness.
    Type: Grant
    Filed: December 2, 2004
    Date of Patent: July 6, 2010
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yung-Chih Chang, Cheng-I Sun, Chun-I Kuo, Fu-Kun Yeh, Hsueh-Chi Shen
  • Publication number: 20060143599
    Abstract: A software deployment system and method are provided. The system includes a server and at least one client. The server executes a first server application and a second server application simultaneously. The client controls at least one equipment tool, executes a first client application connected to the first server application, and has a second client application. In response to a deployment signal, the client first deletes the first client application and executes the second client application to connect to the second server application if all equipment tools controlled by the client are idle. The client then transmits a completion signal to the server. If software deployment on each client is complete, the server deletes the first server application.
    Type: Application
    Filed: December 28, 2004
    Publication date: June 29, 2006
    Inventors: Fu-Kun Yeh, Ting-Yuan Huang
  • Publication number: 20060122728
    Abstract: A thermal process system. The thermal process system comprises a thermal processor, a metrology tool, and a controller. The thermal processor performs a thermal process as defined by a heating model to form a film on a wafer surface. The metrology tool, interfaced with the thermal processor, inspects thickness of the film. The controller, coupled with the thermal processor and the metrology tool, generates the heating model of the thermal processor and calibrates the heating model according to a preset slope coefficient matrix and the measured thickness.
    Type: Application
    Filed: December 2, 2004
    Publication date: June 8, 2006
    Inventors: Yung-Chih Chang, Cheng-I Sun, Chun-I Kuo, Fu-Kun Yeh, Hsueh-Chi Shen
  • Publication number: 20030221139
    Abstract: Within a method for operating a software product within a manufacturing facility, there is provided within an information system within the manufacturing facility a troubleshooting utility which is continuously updated to provide a series of updated troubleshooting procedures for the software product. By continuously updating the troubleshooting utility, a malfunction with the software product may be more efficiently addressed.
    Type: Application
    Filed: May 23, 2002
    Publication date: November 27, 2003
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Lee-Chung Lin, Fu-Kun Yeh